Inventor · disambiguated record
Emmanuel Espiritu
Also filed as: ESPIRITU EMMANUEL · ESPIRITU EMMANUEL A
54 granted patents·6 pending applications·377 citations·filing 2006–2024
98Inventor score
Files withCAMACHO ZIGMUND RAMIREZ22STATS CHIPPAC LTD7CAMACHO ZIGMUND R6BATHAN HENRY DESCALZO5ESPIRITU EMMANUEL5
Top patents by PatentIndex Score
60 records- 0198US8993376B2Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor dieCAMACHO ZIGMUND R·Filed 2011·Granted Mar 31, 2015·52 cites·23 claims
- 0298US8409922B2Semiconductor device and method of forming leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnectCAMACHO ZIGMUND R·Filed 2010·Granted Apr 2, 2013·58 cites·31 claims
- 0398US8076184B1Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor dieCAMACHO ZIGMUND R·Filed 2010·Granted Dec 13, 2011·43 cites·12 claims
- 0497US9006031B2Semiconductor device and method of forming EWLB package with standoff conductive layer over encapsulant bumpsCAMACHO ZIGMUND R·Filed 2011·Granted Apr 14, 2015·40 cites·24 claims
- 0596US8241956B2Semiconductor device and method of forming wafer level multi-row etched lead packageCAMACHO ZIGMUND R·Filed 2010·Granted Aug 14, 2012·25 cites·20 claims
- 0689US8866275B2Leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnectSTATS CHIPPAC LTD·Filed 2013·Granted Oct 21, 2014·8 cites·25 claims
- 0789US8193037B1Integrated circuit packaging system with pad connection and method of manufacture thereofBATHAN HENRY DESCALZO·Filed 2010·Granted Jun 5, 2012·11 cites·11 claims
- 0887US8026129B2Stacked integrated circuits package system with passive componentsSTATS CHIPPAC LTD·Filed 2006·Granted Sep 27, 2011·16 cites·20 claims
- 0987US7687892B2Quad flat packageSTATS CHIPPAC LTD·Filed 2006·Granted Mar 30, 2010·14 cites·17 claims
- 1086US8334584B2Integrated circuit packaging system with quad flat no-lead package and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2009·Granted Dec 18, 2012·13 cites·20 claims
- 1183US9355983B1Integrated circuit packaging system with interposer structure and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2014·Granted May 31, 2016·5 cites·15 claims
- 1283US9281300B2Chip scale module package in BGA semiconductor packageMERILO LEO A·Filed 2010·Granted Mar 8, 2016·9 cites·15 claims
- 1382US9305809B1Integrated circuit packaging system with coreless substrate and method of manufacture thereofESPIRITU EMMANUEL·Filed 2014·Granted Apr 5, 2016·6 cites·20 claims
- 1482US8809119B1Integrated circuit packaging system with plated leads and method of manufacture thereofESPIRITU EMMANUEL·Filed 2013·Granted Aug 19, 2014·6 cites·20 claims
- 1580US8643166B2Integrated circuit packaging system with leads and method of manufacturing thereofCAMACHO ZIGMUND RAMIREZ·Filed 2011·Granted Feb 4, 2014·5 cites·20 claims
- 1680US8241965B2Integrated circuit packaging system with pad connection and method of manufacture thereofBATHAN HENRY DESCALZO·Filed 2010·Granted Aug 14, 2012·5 cites·20 claims
- 1780US8203201B2Integrated circuit packaging system with leads and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2010·Granted Jun 19, 2012·5 cites·17 claims
- 1879US8803300B2Integrated circuit packaging system with protective coating and method of manufacture thereofBATHAN HENRY DESCALZO·Filed 2010·Granted Aug 12, 2014·5 cites·16 claims
- 1978US8395254B2Integrated circuit package system with heatspreaderESPIRITU EMMANUEL·Filed 2006·Granted Mar 12, 2013·9 cites·20 claims
- 2076US8617933B2Integrated circuit packaging system with interlock and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2011·Granted Dec 31, 2013·4 cites·3 claims
- 2175US2025126909A1Reliable semiconductors packagesUTAC HEADQUARTERS PTE LTD·Filed 2024·Application pending·0 cites
- 2273US8802501B2Integrated circuit packaging system with island terminals and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2011·Granted Aug 12, 2014·3 cites·22 claims
- 2373US8604596B2Integrated circuit packaging system with locking interconnects and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2011·Granted Dec 10, 2013·3 cites·14 claims
- 2472US8502358B2Integrated circuit packaging system with multi-row leads and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2010·Granted Aug 6, 2013·3 cites·10 claims
- 2572US8420508B2Integrated circuit packaging system with bump contact on package leads and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2010·Granted Apr 16, 2013·3 cites·7 claims
- 2671US8669649B2Integrated circuit packaging system with interlock and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2010·Granted Mar 11, 2014·3 cites·17 claims
- 2771US7659608B2Stacked die semiconductor device having circuit tapeSTATS CHIPPAC LTD·Filed 2006·Granted Feb 9, 2010·4 cites·24 claims
- 2867US8723324B2Integrated circuit packaging system with pad connection and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2010·Granted May 13, 2014·2 cites·20 claims
- 2966US8502357B2Integrated circuit packaging system with shaped lead and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2010·Granted Aug 6, 2013·2 cites·16 claims
- 3065US8138080B2Integrated circuit package system having interconnect stack and external interconnectFILOTEO JR DARIO S·Filed 2006·Granted Mar 20, 2012·4 cites·20 claims
- 3164US9048228B2Integrated circuit packaging system with side solderable leads and method of manufacture thereofDO BYUNG TAI·Filed 2013·Granted Jun 2, 2015·2 cites·20 claims
- 3263US12211863B2Reliable semiconductor packagesUTAC HEADQUARTERS PTE LTD·Filed 2021·Granted Jan 28, 2025·0 cites·20 claims
- 3362US8482109B2Integrated circuit packaging system with dual connection and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2011·Granted Jul 9, 2013·1 cites·20 claims
- 3462US8415205B2Integrated circuit packaging system with lead interlocking mechanisms and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2010·Granted Apr 9, 2013·1 cites·20 claims
- 3562US7439620B2Integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2006·Granted Oct 21, 2008·2 cites·20 claims
- 3661US8455993B2Integrated circuit packaging system with multiple row leads and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2010·Granted Jun 4, 2013·1 cites·17 claims
- 3761US8404524B2Integrated circuit packaging system with paddle molding and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2010·Granted Mar 26, 2013·1 cites·20 claims
- 3860US7786575B2Stacked die semiconductor device having circuit tapeSTATS CHIPPAC LTD·Filed 2009·Granted Aug 31, 2010·1 cites·11 claims
- 3959US8021931B2Direct via wire bonding and method of assembling the sameSTATS CHIPPAC INC·Filed 2007·Granted Sep 20, 2011·1 cites·25 claims
- 4059US7759169B2Integrated circuit heat spreader stacking methodSTATS CHIPPAC LTD·Filed 2006·Granted Jul 20, 2010·1 cites·9 claims
- 4157US12302657B2Semiconductor device and method of forming an optical semiconductor package with a shield structureUTAC HEADQUARTERS PTE LTD·Filed 2022·Granted May 13, 2025·0 cites·20 claims
- 4256US2023036239A1Semiconductor Device and Method of Making an Optical Semiconductor PackageUTAC HEADQUARTERS PTE LTD·Filed 2022·Application pending·0 cites
- 4351US9659897B1Integrated circuit packaging system with interposer structure and method of manufacture thereofSTATS CHIPPAC PTE LTD·Filed 2016·Granted May 23, 2017·0 cites·14 claims
- 4451US9293351B2Integrated circuit packaging system with planarity control and method of manufacture thereofDO BYUNG TAI·Filed 2012·Granted Mar 22, 2016·0 cites·20 claims
- 4550US9076737B2Integrated circuit packaging system with bumps and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2009·Granted Jul 7, 2015·0 cites·10 claims
- 4649US2012273927A1Semiconductor Device and Method of Forming Wafer Level Multi-Row Etched Lead PackageCAMACHO ZIGMUND R·Filed 2012·Application pending·0 cites
- 4747US8723338B2Integrated circuit packaging system with array contacts and method of manufacture thereofBATHAN HENRY DESCALZO·Filed 2012·Granted May 13, 2014·0 cites·20 claims
- 4845US8421221B2Integrated circuit heat spreader stacking systemFILOTEO JR DARIO S·Filed 2010·Granted Apr 16, 2013·0 cites·9 claims
- 4944US9000579B2Integrated circuit package system with bonding in viaSHIM IL KWON·Filed 2007·Granted Apr 7, 2015·0 cites·18 claims
- 5043US9059151B2Integrated circuit packaging system with island terminals and embedded paddle and method of manufacture thereofCAMACHO ZIGMUND RAMIREZ·Filed 2011·Granted Jun 16, 2015·0 cites·10 claims
Showing the top 50 of 60 patent records by PatentIndex Score.
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