Inventor · disambiguated record
Kian Sin Sim
Also filed as: SIM KIAN S · SIM KIAN SIN
10 granted patents·2 pending applications·34 citations·filing 2003–2019
87Inventor score
Top patents by PatentIndex Score
12 records- 0185US7915060B2Grid array connection device and methodINTEL CORP·Filed 2010·Granted Mar 29, 2011·6 cites·7 claims
- 0283US7670951B2Grid array connection device and methodINTEL CORP·Filed 2005·Granted Mar 2, 2010·8 cites·6 claims
- 0381US9966351B2Grid array connection device and methodINTEL CORP·Filed 2016·Granted May 8, 2018·2 cites·20 claims
- 0479US9449936B2Grid array connection device and methodINTEL CORP·Filed 2015·Granted Sep 20, 2016·2 cites·10 claims
- 0573US6946737B2Robust interlocking viaINTEL CORP·Filed 2004·Granted Sep 20, 2005·14 cites·9 claims
- 0672US9698114B2Grid array connection device and methodTOYAMA MUNEHIRO·Filed 2011·Granted Jul 4, 2017·2 cites·9 claims
- 0763US10741515B2Grid array connection device and methodINTEL CORP·Filed 2019·Granted Aug 11, 2020·0 cites·20 claims
- 0861US10373924B2Grid array connection device and methodINTEL CORP·Filed 2018·Granted Aug 6, 2019·0 cites·20 claims
- 0948US7692301B2Stitched micro-via to enhance adhesion and mechanical strengthINTEL CORP·Filed 2007·Granted Apr 6, 2010·0 cites·7 claims
- 1039US2005081376A1Robust interlocking viaFiled 2003·Application pending·0 cites
- 1138US7229913B2Stitched micro-via to enhance adhesion and mechanical strengthINTEL CORP·Filed 2003·Granted Jun 12, 2007·0 cites·20 claims
- 1235US2005067699A1Diffusion barrier layer for lead free package substrateINTEL CORP·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →