Inventor · disambiguated record
En-Chieh Wu
Also filed as: WU EN-CHIEH
3 granted patents·11 citations·filing 2003–2006
60Inventor score
Technology areasH10W
Files withADVANCED SEMICONDUCTOR ENG3
Top patents by PatentIndex Score
3 records- 0155US7015130B2Method for making UBM pads and bumps on waferADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Mar 21, 2006·9 cites·18 claims
- 0245US7261828B2Bumping processADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Aug 28, 2007·2 cites·17 claims
- 0332US7402510B2Etchant and method for forming bumpsADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jul 22, 2008·0 cites·16 claims
Join the waitlist — get patent alerts
Get an alert when En-Chieh Wu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →