Inventor · disambiguated record
Kuan-Neng Liao
Also filed as: LIAO KUAN-NENG
4 granted patents·1 pending application·131 citations·filing 2000–2003
79Inventor score
Technology areasH10W
Files withADVANCED SEMICONDUCTOR ENG4
Top patents by PatentIndex Score
5 records- 0186US6483187B1Heat-spread substrateADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Nov 19, 2002·61 cites·18 claims
- 0283US6624523B2Structure and package of a heat spreader substrateADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Sep 23, 2003·41 cites·21 claims
- 0373US6918178B2Method of attaching a heat sink to an IC packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jul 19, 2005·26 cites·11 claims
- 0443US6429049B1Laser method for forming viasADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Aug 6, 2002·3 cites·17 claims
- 0531US2002195721A1Cavity down ball grid array packaging structureFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →