Inventor · disambiguated record
Peter Slota, Jr.
Also filed as: SLOTA JR PETER
25 granted patents·1 pending application·172 citations·filing 1985–2019
96Inventor score
Top patents by PatentIndex Score
26 records- 0195US9209141B2Shielded package assemblies with integrated capacitorIBM·Filed 2014·Granted Dec 8, 2015·13 cites·17 claims
- 0294US9059127B1Packages for three-dimensional die stacksIBM·Filed 2014·Granted Jun 16, 2015·15 cites·13 claims
- 0393US9252101B2Packages for three-dimensional die stacksIBM·Filed 2015·Granted Feb 2, 2016·9 cites·7 claims
- 0493US9190399B2Thermally enhanced three-dimensional integrated circuit packageIBM·Filed 2014·Granted Nov 17, 2015·16 cites·20 claims
- 0591US11049819B2Shielded package assemblies with integrated capacitorIBM·Filed 2019·Granted Jun 29, 2021·4 cites·17 claims
- 0689US9935058B2Shielded package assemblies with integrated capacitorIBM·Filed 2016·Granted Apr 3, 2018·4 cites·17 claims
- 0788US9531209B2Shielded package assemblies with integrated capacitorIBM·Filed 2015·Granted Dec 27, 2016·4 cites·13 claims
- 0886US8444043B1Uniform solder reflow fixtureBERNIER WILLIAM E·Filed 2012·Granted May 21, 2013·11 cites·18 claims
- 0983US4615763ARoughening surface of a substrateIBM·Filed 1985·Granted Oct 7, 1986·46 cites·19 claims
- 1082US10553544B2Shielded package assemblies with integrated capacitorIBM·Filed 2017·Granted Feb 4, 2020·2 cites·10 claims
- 1182US9543255B2Reduced-warpage laminate structureIBM·Filed 2016·Granted Jan 10, 2017·3 cites·1 claims
- 1281US9018040B2Power distribution for 3D semiconductor packageIBM·Filed 2013·Granted Apr 28, 2015·5 cites·13 claims
- 1379US8952503B2Organic module EMI shielding structures and methodsIBM·Filed 2013·Granted Feb 10, 2015·4 cites·8 claims
- 1477US8653662B2Structure for monitoring stress induced failures in interlevel dielectric layers of solder bump integrated circuitsLACROIX LUKE D·Filed 2012·Granted Feb 18, 2014·5 cites·19 claims
- 1575US9078373B1Integrated circuit structures having off-axis in-hole capacitor and methods of formingIBM·Filed 2014·Granted Jul 7, 2015·2 cites·9 claims
- 1673US9613915B2Reduced-warpage laminate structureIBM·Filed 2014·Granted Apr 4, 2017·2 cites·16 claims
- 1773US8759977B2Elongated via structuresLACROIX LUKE D·Filed 2012·Granted Jun 24, 2014·3 cites·12 claims
- 1866US9599664B2Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structuresIBM·Filed 2015·Granted Mar 21, 2017·1 cites·19 claims
- 1964US9245854B2Organic module EMI shielding structures and methodsIBM·Filed 2014·Granted Jan 26, 2016·1 cites·18 claims
- 2062US9057760B2Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structuresLACROIX LUKE D·Filed 2011·Granted Jun 16, 2015·1 cites·18 claims
- 2162US8586982B2Semiconductor test chip device to mimic field thermal mini-cycles to assess reliabilityLACROIX LUKE D·Filed 2010·Granted Nov 19, 2013·1 cites·20 claims
- 2255US10685919B2Reduced-warpage laminate structureIBM·Filed 2017·Granted Jun 16, 2020·0 cites·9 claims
- 2354US9185807B2Integrated circuit structures having off-axis in-hole capacitorIBM·Filed 2015·Granted Nov 10, 2015·0 cites·11 claims
- 2454US4846929AWet etching of thermally or chemically cured polyimideIBM·Filed 1988·Granted Jul 11, 1989·20 cites·37 claims
- 2552US8999846B2Elongated via structuresIBM·Filed 2014·Granted Apr 7, 2015·0 cites·18 claims
- 2634US2012074559A1Integrated circuit package using through substrate vias to ground lidBUDELL TIMOTHY W·Filed 2010·Application pending·0 cites
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