Inventor · disambiguated record
David C. Strippe
Also filed as: STRIPPE DAVID C · STRIPPE DAVID CRAIG
12 granted patents·2 pending applications·186 citations·filing 1987–2015
91Inventor score
Top patents by PatentIndex Score
14 records- 0179US5628889AHigh power capacity magnetron cathodeIBM·Filed 1994·Granted May 13, 1997·34 cites·18 claims
- 0276US8052799B2By-product collecting processes for cleaning processesIBM·Filed 2006·Granted Nov 8, 2011·5 cites·16 claims
- 0373US5401675AMethod of depositing conductors in high aspect ratio apertures using a collimatorFiled 1993·Granted Mar 28, 1995·49 cites·12 claims
- 0469US4791261ACrucible for evaporation of metallic filmIBM·Filed 1987·Granted Dec 13, 1988·26 cites·13 claims
- 0567US5529670AMethod of depositing conductors in high aspect ratio apertures under high temperature conditionsIBM·Filed 1993·Granted Jun 25, 1996·37 cites·10 claims
- 0657US7485210B2Sputtering target fixtureIBM·Filed 2004·Granted Feb 3, 2009·2 cites·1 claims
- 0754US8969195B2Methods of manufacturing semiconductor devices and a semiconductor structureANDERSON FELIX P·Filed 2008·Granted Mar 3, 2015·0 cites·24 claims
- 0854US8157970B2Sputtering target fixtureMURPHY WILLIAM J·Filed 2008·Granted Apr 17, 2012·0 cites·30 claims
- 0951US6245668B1Sputtered tungsten diffusion barrier for improved interconnect robustnessIBM·Filed 1998·Granted Jun 12, 2001·14 cites·22 claims
- 1044US4876114AProcess for the self fractionation deposition of a metallic layer on a workpieceIBM·Filed 1988·Granted Oct 24, 1989·12 cites·6 claims
- 1144US2015130064A1Methods of manufacturing semiconductor devices and a semiconductor structureIBM·Filed 2015·Application pending·0 cites
- 1243US2009078562A1Method of system maintenance planning based on continual robot parameter monitoringIBM·Filed 2007·Application pending·0 cites
- 1340US6838364B2Sputtered tungsten diffusion barrier for improved interconnect robustnessIBM·Filed 2001·Granted Jan 4, 2005·0 cites·17 claims
- 1439US6210541B1Process and apparatus for cold copper deposition to enhance copper plating fillIBM·Filed 1998·Granted Apr 3, 2001·7 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →