Inventor · disambiguated record
William J. Murphy
Also filed as: MURPHY WILLIAM J · MURPHY WILLIAM JOSEPH
58 granted patents·8 pending applications·505 citations·filing 1997–2018
98Inventor score
Top patents by PatentIndex Score
66 records- 0198US9041128B2Planar cavity MEMS and related structures, methods of manufacture and design structuresIBM·Filed 2013·Granted May 26, 2015·30 cites·14 claims
- 0297US8921144B2Planar cavity MEMS and related structures, methods of manufacture and design structuresDUNBAR III GEORGE A·Filed 2010·Granted Dec 30, 2014·50 cites·22 claims
- 0397US8865497B2Planar cavity MEMS and related structures, methods of manufacture and design structuresDUNBAR III GEORGE A·Filed 2010·Granted Oct 21, 2014·27 cites·27 claims
- 0495US8604618B2Structure and method for reducing vertical crack propagationCOONEY III EDWARD C·Filed 2011·Granted Dec 10, 2013·24 cites·21 claims
- 0594US7662722B2Air gap under on-chip passive deviceIBM·Filed 2007·Granted Feb 16, 2010·31 cites·17 claims
- 0692US9171971B2Encapsulated sensorsIBM·Filed 2013·Granted Oct 27, 2015·7 cites·19 claims
- 0787US6534394B1Process to create robust contacts and interconnectsIBM·Filed 2000·Granted Mar 18, 2003·36 cites·26 claims
- 0886US9406472B2Planar cavity MEMS and related structures, methods of manufacture and design structuresDANG DINH·Filed 2010·Granted Aug 2, 2016·2 cites·19 claims
- 0985US8881379B2Method of making heat sink for integrated circuit devicesCOOLBAUGH DOUGLAS D·Filed 2012·Granted Nov 11, 2014·4 cites·17 claims
- 1085US5993615AMethod and apparatus for detecting arcsIBM·Filed 1997·Granted Nov 30, 1999·82 cites·27 claims
- 1183US7994895B2Heat sink for integrated circuit devicesIBM·Filed 2007·Granted Aug 9, 2011·8 cites·30 claims
- 1278US8230586B2Method of cooling a resistorCOOLBAUGH DOUGLAS D·Filed 2007·Granted Jul 31, 2012·4 cites·14 claims
- 1376US8052799B2By-product collecting processes for cleaning processesIBM·Filed 2006·Granted Nov 8, 2011·5 cites·16 claims
- 1475US8796044B2Ferroelectric random access memory with optimized hardmaskIBM·Filed 2012·Granted Aug 5, 2014·3 cites·10 claims
- 1575US6117771AMethod for depositing cobaltIBM·Filed 1998·Granted Sep 12, 2000·38 cites·17 claims
- 1674US7687867B2Inexpensive method of fabricating a higher performance capacitance density MIMcap integrable into a copper interconnect schemeIBM·Filed 2007·Granted Mar 30, 2010·5 cites·11 claims
- 1774US6387790B1Conversion of amorphous layer produced during IMP Ti depositionIBM·Filed 2000·Granted May 14, 2002·19 cites·19 claims
- 1873US7282404B2Inexpensive method of fabricating a higher performance capacitance density MIMcap integrable into a copper interconnect schemeIBM·Filed 2004·Granted Oct 16, 2007·16 cites·11 claims
- 1972US10589992B2Micro-electro-mechanical system (MEMS) structures and design structuresIBM·Filed 2018·Granted Mar 17, 2020·0 cites·11 claims
- 2072US10549987B2Micro-electro-mechanical system (MEMS) structures and design structuresIBM·Filed 2018·Granted Feb 4, 2020·0 cites·16 claims
- 2171US10589991B2Micro-electro-mechanical system (MEMS) structures and design structuresIBM·Filed 2018·Granted Mar 17, 2020·0 cites·20 claims
- 2271US9275868B2Uniform roughness on backside of a waferIBM·Filed 2013·Granted Mar 1, 2016·2 cites·20 claims
- 2371US8586466B2Electrical fuse with a current shuntLEE TOM C·Filed 2010·Granted Nov 19, 2013·4 cites·11 claims
- 2471US7056820B2Bond padIBM·Filed 2003·Granted Jun 6, 2006·20 cites·17 claims
- 2568US8658435B2Hydrogen barrier liner for ferro-electric random access memory (FRAM) chipIBM·Filed 2013·Granted Feb 25, 2014·2 cites·14 claims
- 2668US8395196B2Hydrogen barrier liner for ferro-electric random access memory (FRAM) chipCZABAJ BRIAN M·Filed 2010·Granted Mar 12, 2013·3 cites·15 claims
- 2768US8003536B2Electromigration resistant aluminum-based metal interconnect structureIBM·Filed 2009·Granted Aug 23, 2011·2 cites·7 claims
- 2866US9981842B2Micro-Electro-Mechanical System (MEMS) structures and design structuresIBM·Filed 2016·Granted May 29, 2018·0 cites·20 claims
- 2966US9938137B2Micro-electro-mechanical system (MEMS) structures and design structuresIBM·Filed 2016·Granted Apr 10, 2018·0 cites·18 claims
- 3066US7166904B2Structure and method for local resistor element in integrated circuit technologyIBM·Filed 2004·Granted Jan 23, 2007·12 cites·44 claims
- 3165US6184132B1Integrated cobalt silicide process for semiconductor devicesIBM·Filed 1999·Granted Feb 6, 2001·22 cites·20 claims
- 3264US11167980B2Micro-electro-mechanical system (MEMS) structures and design structuresIBM·Filed 2015·Granted Nov 9, 2021·0 cites·13 claims
- 3364US9969613B2Method for forming micro-electro-mechanical system (MEMS) beam structureIBM·Filed 2013·Granted May 15, 2018·0 cites·19 claims
- 3464US9685370B2Titanium tungsten liner used with copper interconnectsIBM·Filed 2014·Granted Jun 20, 2017·1 cites·19 claims
- 3564US7310036B2Heat sink for integrated circuit devicesIBM·Filed 2005·Granted Dec 18, 2007·2 cites·5 claims
- 3662US9932222B2Micro-electro-mechanical system (MEMS) structures and design structuresIBM·Filed 2016·Granted Apr 3, 2018·0 cites·18 claims
- 3762US7879716B2Metal seed layer depositionIBM·Filed 2007·Granted Feb 1, 2011·2 cites·18 claims
- 3861US8846481B2Transistor and method of forming the transistor so as to have reduced base resistanceIBM·Filed 2013·Granted Sep 30, 2014·1 cites·18 claims
- 3959US8084864B2Electromigration resistant aluminum-based metal interconnect structureCHAPPLE-SOKOL JONATHAN D·Filed 2011·Granted Dec 27, 2011·1 cites·13 claims
- 4058US6882052B2Plasma enhanced linerIBM·Filed 2003·Granted Apr 19, 2005·6 cites·13 claims
- 4157US7843039B2Stress-modified device structures, methods of fabricating such stress-modified device structures, and design structures for an integrated circuitIBM·Filed 2008·Granted Nov 30, 2010·1 cites·16 claims
- 4257US7485210B2Sputtering target fixtureIBM·Filed 2004·Granted Feb 3, 2009·2 cites·1 claims
- 4357US6762121B2Method of forming refractory metal contact in an opening, and resulting structureIBM·Filed 2001·Granted Jul 13, 2004·2 cites·16 claims
- 4455US10446421B2Crystal oscillator and the use thereof in semiconductor fabricationGLOBALFOUNDRIES INC·Filed 2018·Granted Oct 15, 2019·0 cites·17 claims
- 4555US8524596B2Techniques for improving bond pad performanceBEAULIEU FREDERIC·Filed 2012·Granted Sep 3, 2013·1 cites·20 claims
- 4654US8969195B2Methods of manufacturing semiconductor devices and a semiconductor structureANDERSON FELIX P·Filed 2008·Granted Mar 3, 2015·0 cites·24 claims
- 4754US8157970B2Sputtering target fixtureMURPHY WILLIAM J·Filed 2008·Granted Apr 17, 2012·0 cites·30 claims
- 4852US9971341B2Crystal oscillator and the use thereof in semiconductor fabricationIBM·Filed 2014·Granted May 15, 2018·0 cites·9 claims
- 4951US7235487B2Metal seed layer depositionIBM·Filed 2004·Granted Jun 26, 2007·4 cites·9 claims
- 5051US7052925B2Method for manufacturing self-compensating resistors within an integrated circuitIBM·Filed 2004·Granted May 30, 2006·4 cites·8 claims
Showing the top 50 of 66 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when William J. Murphy files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →