Inventor · disambiguated record
Munehiro Hatai
Also filed as: HATAI MUNEHIRO
4 granted patents·9 pending applications·42 citations·filing 2001–2022
73Inventor score
Top patents by PatentIndex Score
13 records- 0176US6939741B2IC chip manufacturing methodDISCO CORP·Filed 2003·Granted Sep 6, 2005·22 cites·6 claims
- 0272US7335578B2Method for manufacturing semiconductor chipSEKISUI CHEMICAL CO LTD·Filed 2003·Granted Feb 26, 2008·17 cites·16 claims
- 0357US2006269715A1Adhesive material, method for peeling adhesive material, and pressure-sensitive adhesive tapeSEKISUI CHEMICAL CO LTD·Filed 2006·Application pending·0 cites
- 0448US9011629B2Adhesive for electronic components, and manufacturing method for semiconductor chip mountDILAO CARL ALVIN·Filed 2012·Granted Apr 21, 2015·1 cites·14 claims
- 0547US2005173051A1Adhesive material, method for peeling adhesive material, and pressure-sensitive adhesive tapeFiled 2002·Application pending·0 cites
- 0646US2023245936A1Laminate, curable resin composition, method for manufacturing laminate, method for manufacturing substrate having junction electrode, semiconductor device, and image capturing deviceSEKISUI CHEMICAL CO LTD·Filed 2021·Application pending·0 cites
- 0742US2005054758A1Adhesive substance, adhesive product, and connected structureFiled 2002·Application pending·0 cites
- 0841US2025105525A1Radio wave reflectorSEKISUI CHEMICAL CO LTD·Filed 2022·Application pending·0 cites
- 0940US6641912B2Photocurable pressure-sensitive adhesive composition and its sheetSEKISUI CHEMICAL CO LTD·Filed 2001·Granted Nov 4, 2003·2 cites·20 claims
- 1039US2004261943A1Adhesive material, method for unsticking adhesive material and bound structureFUKUOKA MASATERU·Filed 2002·Application pending·0 cites
- 1136US2007037364A1Method for manufacturing semiconductor chipSUGITA DAIHEI·Filed 2004·Application pending·0 cites
- 1235US2008314507A1Ic Chip Manufacturing MethodHATAI MUNEHIRO·Filed 2004·Application pending·0 cites
- 1333US2004248382A1Pressure sensitive adhesive double coated tape and method for producing ic chip using itFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →