Inventor · disambiguated record
Yasuhiko Oyama
Also filed as: OYAMA YASUHIKO
3 granted patents·7 pending applications·53 citations·filing 1988–2006
72Inventor score
Top patents by PatentIndex Score
10 records- 0176US6939741B2IC chip manufacturing methodDISCO CORP·Filed 2003·Granted Sep 6, 2005·22 cites·6 claims
- 0272US7335578B2Method for manufacturing semiconductor chipSEKISUI CHEMICAL CO LTD·Filed 2003·Granted Feb 26, 2008·17 cites·16 claims
- 0361US4883734AToner for development of electrostatic image and method of fixing employing the sameKONISHIROKU PHOTO IND·Filed 1988·Granted Nov 28, 1989·14 cites·14 claims
- 0457US2006269715A1Adhesive material, method for peeling adhesive material, and pressure-sensitive adhesive tapeSEKISUI CHEMICAL CO LTD·Filed 2006·Application pending·0 cites
- 0547US2005173051A1Adhesive material, method for peeling adhesive material, and pressure-sensitive adhesive tapeFiled 2002·Application pending·0 cites
- 0642US2005054758A1Adhesive substance, adhesive product, and connected structureFiled 2002·Application pending·0 cites
- 0739US2004261943A1Adhesive material, method for unsticking adhesive material and bound structureFUKUOKA MASATERU·Filed 2002·Application pending·0 cites
- 0836US2007037364A1Method for manufacturing semiconductor chipSUGITA DAIHEI·Filed 2004·Application pending·0 cites
- 0935US2008314507A1Ic Chip Manufacturing MethodHATAI MUNEHIRO·Filed 2004·Application pending·0 cites
- 1033US2004248382A1Pressure sensitive adhesive double coated tape and method for producing ic chip using itFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →