Inventor · disambiguated record

Takumi Ookabe

Also filed as: OOKABE TAKUMI

1 granted patent·1 pending application·0 citations·filing 2021–2021

10Inventor score

Technology areasH10W

Files withNIPPON MICROMETAL CORP2

Top patents by PatentIndex Score

2 records

0154US12463172B2AG alloy bonding wire for semiconductor devices and semiconductor deviceNIPPON MICROMETAL CORP·Filed 2021·Granted Nov 4, 2025·0 cites·8 claims
0245US2023402422A1Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICENIPPON MICROMETAL CORP·Filed 2021·Application pending·0 cites

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →