Inventor · disambiguated record
Takamitsu Noda
Also filed as: NODA TAKAMITSU
7 granted patents·2 pending applications·24 citations·filing 2005–2021
79Inventor score
Top patents by PatentIndex Score
9 records- 0186US7554211B2Semiconductor wafer and manufacturing process for semiconductor deviceNEC ELECTRONICS CORP·Filed 2005·Granted Jun 30, 2009·13 cites·16 claims
- 0274US8053337B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Nov 8, 2011·4 cites·17 claims
- 0366US7759223B2Semiconductor wafer and manufacturing process for semiconductor deviceNEC ELECTRONICS CORP·Filed 2009·Granted Jul 20, 2010·2 cites·13 claims
- 0465US9087826B2Method for manufacturing semiconductor device using mold having resin dam and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Jul 21, 2015·2 cites·27 claims
- 0564US7888809B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2009·Granted Feb 15, 2011·3 cites·8 claims
- 0652US11402591B2Optical coupling deviceTOSHIBA KK·Filed 2021·Granted Aug 2, 2022·0 cites·13 claims
- 0747US11699692B2Semiconductor device and method for manufacturing sameTOSHIBA KK·Filed 2021·Granted Jul 11, 2023·0 cites·15 claims
- 0841US2015235937A1Method For Manufacturing Semiconductor Device Using Mold Having Resin Dam And Semiconductor DeviceRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 0935US2010176517A1Electronic deviceNEC ELECTRONICS CORP·Filed 2010·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Takamitsu Noda files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →