Inventor · disambiguated record
Ken Vanhille
Also filed as: VANHILLE KEN
6 granted patents·2 pending applications·56 citations·filing 2014–2019
82Inventor score
Top patents by PatentIndex Score
8 records- 0195US9306254B1Substrate-free mechanical interconnection of electronic sub-systems using a spring configurationNUVOTRONICS LLC·Filed 2014·Granted Apr 5, 2016·33 cites·13 claims
- 0293US9888600B2Substrate-free interconnected electronic mechanical structural systemsNUVOTRONICS INC·Filed 2016·Granted Feb 6, 2018·13 cites·20 claims
- 0389US9306255B1Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each otherNUVOTRONICS LLC·Filed 2014·Granted Apr 5, 2016·7 cites·16 claims
- 0480US10193203B2Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systemsNUVOTRONICS INC·Filed 2018·Granted Jan 29, 2019·2 cites·19 claims
- 0569US10361471B2Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systemsNUVOTRONICS INC·Filed 2016·Granted Jul 23, 2019·1 cites·15 claims
- 0662US2020022277A1Substrate-free interconnected electronic mechanical structural systemsNUVOTRONICS INC·Filed 2019·Application pending·0 cites
- 0759US2019393580A1Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3d systemsNUVOTRONICS INC·Filed 2019·Application pending·0 cites
- 0858US10257951B2Substrate-free interconnected electronic mechanical structural systemsNUVOTRONICS INC·Filed 2017·Granted Apr 9, 2019·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →