Inventor · disambiguated record
J. Robert Reid
Also filed as: REID J ROBERT · REID JR J ROBERT
10 granted patents·3 pending applications·71 citations·filing 2010–2019
87Inventor score
Top patents by PatentIndex Score
13 records- 0195US9306254B1Substrate-free mechanical interconnection of electronic sub-systems using a spring configurationNUVOTRONICS LLC·Filed 2014·Granted Apr 5, 2016·33 cites·13 claims
- 0293US9888600B2Substrate-free interconnected electronic mechanical structural systemsNUVOTRONICS INC·Filed 2016·Granted Feb 6, 2018·13 cites·20 claims
- 0389US9306255B1Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each otherNUVOTRONICS LLC·Filed 2014·Granted Apr 5, 2016·7 cites·16 claims
- 0488US8230564B1Method of making a millimeter wave transmission line filterREID JR J ROBERT·Filed 2010·Granted Jul 31, 2012·13 cites·18 claims
- 0580US10193203B2Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systemsNUVOTRONICS INC·Filed 2018·Granted Jan 29, 2019·2 cites·19 claims
- 0672US9660614B2Stacked, switched filter banksNUVOTRONICS INC·Filed 2016·Granted May 23, 2017·2 cites·15 claims
- 0769US10361471B2Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systemsNUVOTRONICS INC·Filed 2016·Granted Jul 23, 2019·1 cites·15 claims
- 0862US2020022277A1Substrate-free interconnected electronic mechanical structural systemsNUVOTRONICS INC·Filed 2019·Application pending·0 cites
- 0959US2019393580A1Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3d systemsNUVOTRONICS INC·Filed 2019·Application pending·0 cites
- 1058US10257951B2Substrate-free interconnected electronic mechanical structural systemsNUVOTRONICS INC·Filed 2017·Granted Apr 9, 2019·0 cites·20 claims
- 1154US10553511B2Integrated chip scale packagesCUBIC CORP·Filed 2019·Granted Feb 4, 2020·0 cites·19 claims
- 1253US10319654B1Integrated chip scale packagesNUVOTRONICS INC·Filed 2017·Granted Jun 11, 2019·0 cites·25 claims
- 1344US2012256708A1Millimeter Wave Filter for Wireless Communications SystemsREID JR J ROBERT·Filed 2012·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when J. Robert Reid files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →