Inventor · disambiguated record
Chew B. Chan
Also filed as: CHAN CHEW B · CHAN CHEW BENG
3 granted patents·3 citations·filing 2006–2012
54Inventor score
Top patents by PatentIndex Score
3 records- 0153US8648460B2Thermal interface material with epoxidized nutshell oilNGUYEN MY NHU·Filed 2012·Granted Feb 11, 2014·1 cites·11 claims
- 0247US8075721B2Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkabilityJI QING·Filed 2006·Granted Dec 13, 2011·2 cites·1 claims
- 0322US8273606B2Method of fabricating a semiconductor package using a fluxing underfill composition applied to solder balls in a dip processCHAN CHEW B·Filed 2010·Granted Sep 25, 2012·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →