Inventor · disambiguated record
James R. Bupp
Also filed as: BUPP JAMES R · BUPP JAMES RUSSELL
12 granted patents·811 citations·filing 1981–2005
94Inventor score
Files withIBM12
Top patents by PatentIndex Score
12 records- 0198US6902869B2Manufacturing methods for printed circuit boardsIBM·Filed 2003·Granted Jun 7, 2005·156 cites·15 claims
- 0296US6222136B1Printed circuit board with continuous connective bumpsIBM·Filed 1997·Granted Apr 24, 2001·131 cites·13 claims
- 0390US5519936AMethod of making an electronic package with a thermally conductive support member having a thin circuitized substrate and semiconductor device bonded theretoIBM·Filed 1995·Granted May 28, 1996·113 cites·9 claims
- 0488US4478883AConditioning of a substrate for electroless direct bond plating in holes and on surfaces of a substrateIBM·Filed 1982·Granted Oct 23, 1984·57 cites·27 claims
- 0586US6639155B1High performance packaging platform and method of making sameIBM·Filed 1997·Granted Oct 28, 2003·62 cites·13 claims
- 0684US4554182AMethod for conditioning a surface of a dielectric substrate for electroless platingIBM·Filed 1985·Granted Nov 19, 1985·50 cites·46 claims
- 0782US5561323AElectronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded theretoIBM·Filed 1995·Granted Oct 1, 1996·67 cites·26 claims
- 0880US5773884AElectronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded theretoIBM·Filed 1997·Granted Jun 30, 1998·67 cites·16 claims
- 0977US6684497B2Manufacturing methods for printed circuit boardsIBM·Filed 2001·Granted Feb 3, 2004·16 cites·14 claims
- 1077US5633533AElectronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded theretoIBM·Filed 1996·Granted May 27, 1997·58 cites·26 claims
- 1175US4400618AMethod of detecting and analyzing damage in printed circuit boardsIBM·Filed 1981·Granted Aug 23, 1983·32 cites·6 claims
- 1267US7240430B2Manufacturing methods for printed circuit boardsIBM·Filed 2005·Granted Jul 10, 2007·2 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →