Inventor · disambiguated record
Hyunbae Lee
Also filed as: LEE HYUNBAE
11 granted patents·6 pending applications·8 citations·filing 2008–2023
82Inventor score
Top patents by PatentIndex Score
17 records- 0181US12451421B2Semiconductor device with double etch stop layer and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 21, 2025·1 cites·17 claims
- 0281US10192782B2Method of manufacturing semiconductor device using a plurality of etch stop layersLEE WOOJIN·Filed 2015·Granted Jan 29, 2019·4 cites·20 claims
- 0367US11929366B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 12, 2024·0 cites·19 claims
- 0464US11830874B2Method of fabricating a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 28, 2023·0 cites·20 claims
- 0562US12419086B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 16, 2025·0 cites·20 claims
- 0662US11233050B2Semiconductor device with diffusion barrier in the active contactSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 25, 2022·0 cites·20 claims
- 0760US8404593B2Semiconductor devices including interlayer conductive contacts and methods of forming the sameHONG JONGWON·Filed 2011·Granted Mar 26, 2013·2 cites·17 claims
- 0858US11374001B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 28, 2022·0 cites·16 claims
- 0957US7888798B2Semiconductor devices including interlayer conductive contacts and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Feb 15, 2011·1 cites·22 claims
- 1055US2024128335A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1154US12354943B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 8, 2025·0 cites·19 claims
- 1254US2024250000A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1352US12230682B2Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 18, 2025·0 cites·20 claims
- 1452US2024154017A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1551US2024222451A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1650US2024128319A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1749US2022262738A1Integrated circuit chip including wiring structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →