Inventor · disambiguated record
Chan Ki Hwang
Also filed as: HWANG CHAN · HWANG CHAN KI
1 granted patent·2 pending applications·4 citations·filing 2005–2024
24Inventor score
Top patents by PatentIndex Score
3 records- 0166US8223248B2Image sensor module having a semiconductor chip, a holder and a coupling memberLEE SEUNG HYUN·Filed 2009·Granted Jul 17, 2012·4 cites·20 claims
- 0258US2025218817A1Substrate bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0331US2006284298A1Chip stack package having same length bonding leadsKIM JAE MYUN·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →