Inventor · disambiguated record
Marco Omar Ghidoni
Also filed as: GHIDONI MARCO OMAR
10 granted patents·1 pending application·29 citations·filing 2016–2023
85Inventor score
Top patents by PatentIndex Score
11 records- 0192US10605684B2Multi-transducer modulus, electronic apparatus including the multi-transducer modulus and method for manufacturing the multi-transducer modulusST MICROELECTRONICS SRL·Filed 2017·Granted Mar 31, 2020·9 cites·23 claims
- 0287US11069587B2Integrated semiconductor device and process for manufacturing an integrated semiconductor deviceST MICROELECTRONICS SRL·Filed 2020·Granted Jul 20, 2021·2 cites·25 claims
- 0387US11053115B2Multi-device transducer modulus, electronic apparatus including the transducer modulus and method for manufacturing the transducer modulusST MICROELECTRONICS SRL·Filed 2017·Granted Jul 6, 2021·5 cites·20 claims
- 0487US10189703B2Multi-chamber transducer module, apparatus including the multi-chamber transducer module and method of manufacturing the multi-chamber transducer moduleST MICROELECTRONICS SRL·Filed 2016·Granted Jan 29, 2019·6 cites·18 claims
- 0584US10597287B2Multi-chamber transducer module, apparatus including the multi-chamber transducer module and method of manufacturing the multi-chamber transducer moduleST MICROELECTRONICS SRL·Filed 2018·Granted Mar 24, 2020·2 cites·19 claims
- 0681US10091587B2Multi-device transducer module, apparatus including the transducer module and method of manufacturing the transducer moduleST MICROELECTRONICS SRL·Filed 2016·Granted Oct 2, 2018·3 cites·21 claims
- 0770US10531204B2Multi-device transducer module, apparatus including the transducer module and method of manufacturing the transducer moduleST MICROELECTRONICS SRL·Filed 2018·Granted Jan 7, 2020·1 cites·20 claims
- 0867US10910500B2Load sensing devices, packages, and systemsST MICROELECTRONICS SRL·Filed 2018·Granted Feb 2, 2021·1 cites·32 claims
- 0960US11718519B2Packaged environmental sensorST MICROELECTRONICS SRL·Filed 2020·Granted Aug 8, 2023·0 cites·20 claims
- 1056US2025003819A1Ultra-compact stacked differential pressure sensorST MICROELECTRONICS INT NV·Filed 2023·Application pending·0 cites
- 1152US12025506B2Ambient temperature sensor which may be coupled to a printed circuit board with an improved packageST MICROELECTRONICS SRL·Filed 2021·Granted Jul 2, 2024·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →