Inventor · disambiguated record
Zao-Kuo Lai
Also filed as: LAI ZAO-KUO
5 granted patents·69 citations·filing 2004–2008
80Inventor score
Top patents by PatentIndex Score
5 records- 0191US7507915B2Stack structure of carrier boards embedded with semiconductor components and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Mar 24, 2009·31 cites·3 claims
- 0284US7754598B2Method for manufacturing coreless packaging substratePHOENIX PREC TECHNOLOGY CORP·Filed 2008·Granted Jul 13, 2010·10 cites·14 claims
- 0379US7880296B2Chip carrier structure having semiconductor chip embedded therein and metal layer formed thereonUNIMICRON TECHNOLOGY CORP·Filed 2008·Granted Feb 1, 2011·10 cites·12 claims
- 0470US7135377B1Semiconductor package substrate with embedded resistors and method for fabricating samePHOENIX PREC TECHNOLOGY CORP·Filed 2005·Granted Nov 14, 2006·5 cites·10 claims
- 0566US7323762B2Semiconductor package substrate with embedded resistors and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2004·Granted Jan 29, 2008·13 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →