Inventor · disambiguated record
Shinji Iioka
Also filed as: IIOKA SHINJI
4 granted patents·1 pending application·36 citations·filing 1998–2008
72Inventor score
Top patents by PatentIndex Score
5 records- 0171US6462148B1Adhesive film of quinoline polymer and bismaleimideHITACHI CHEMICAL CO LTD·Filed 1998·Granted Oct 8, 2002·23 cites·15 claims
- 0250US2009022893A1Punched adhesive tape for semicconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frameTANABE YOSHIYUKI·Filed 2008·Application pending·0 cites
- 0349US6523446B1Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frameHITACHI CHEMICAL CO LTD·Filed 1998·Granted Feb 25, 2003·13 cites·17 claims
- 0446US7449076B2Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frameHITACHI CHEMICAL CO LTD·Filed 2005·Granted Nov 11, 2008·0 cites·2 claims
- 0537US7273654B2Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frameHITACHI CHEMICAL CO LTD·Filed 2002·Granted Sep 25, 2007·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →