Inventor · disambiguated record
Johnny Cheng
Also filed as: CHENG JOHNNY
6 granted patents·1 pending application·73 citations·filing 1997–2003
83Inventor score
Files withTEXAS INSTRUMENTS INC6
Top patents by PatentIndex Score
7 records- 0179US6504238B2Leadframe with elevated small mount padsTEXAS INSTRUMENTS INC·Filed 2001·Granted Jan 7, 2003·37 cites·13 claims
- 0257US6989606B2BGA substrate via structureTEXAS INSTRUMENTS INC·Filed 2003·Granted Jan 24, 2006·6 cites·6 claims
- 0357US6596620B2BGA substrate via structureTEXAS INSTRUMENTS INC·Filed 2002·Granted Jul 22, 2003·6 cites·9 claims
- 0452US6441486B1BGA substrate via structureTEXAS INSTRUMENTS INC·Filed 2001·Granted Aug 27, 2002·4 cites·16 claims
- 0551US6249963B1System and method for coupling conductive pellets to a component of an integrated circuitTEXAS INSTRUMENTS INC·Filed 1997·Granted Jun 26, 2001·15 cites·6 claims
- 0633US2002084537A1System and method for packaging a semiconductor dieFiled 2000·Application pending·0 cites
- 0729US6265769B1Double-sided chip mount packageTEXAS INSTRUMENTS INC·Filed 1998·Granted Jul 24, 2001·5 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →