Inventor · disambiguated record
Michael W. Cumbie
Also filed as: CUMBIE JR MICHAEL W · CUMBIE MICHAEL · CUMBIE MICHAEL W · CUMBIE MICHAEL WAYNE
233 granted patents·52 pending applications·383 citations·filing 2006–2025
99Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO264HEWLETT PACKARD DEVELOPMENT CO LP16BENGALI SADIQ2CUMBIE MICHAEL1HEWLETT PACKARD ENTPR DEV LP1
Top patents by PatentIndex Score
285 records- 0199US10107667B2Liquid level indicatingHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Oct 23, 2018·46 cites·16 claims
- 0298US11034157B2Logic circuitryHEWLETT PACKARD DEVELOPMENT CO·Filed 2020·Granted Jun 15, 2021·29 cites·20 claims
- 0398US10875318B1Logic circuitryHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Dec 29, 2020·31 cites·29 claims
- 0498US10022962B1Fluidic dieHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Jul 17, 2018·15 cites·13 claims
- 0598US9944080B2Molded fluid flow structureHEWLETT PACKARD DEVELOPMENT CO·Filed 2013·Granted Apr 17, 2018·13 cites·15 claims
- 0698US9844946B2Molded printheadHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2016·Granted Dec 19, 2017·6 cites·20 claims
- 0798US9724920B2Molded die slivers with exposed front and back surfacesHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2014·Granted Aug 8, 2017·14 cites·14 claims
- 0897US11364719B2Print component with memory array using intermittent clock signalHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Jun 21, 2022·7 cites·12 claims
- 0997US10894423B2Logic circuitryHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Jan 19, 2021·29 cites·25 claims
- 1097US9446587B2Molded printheadHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2013·Granted Sep 20, 2016·17 cites·20 claims
- 1196US11712896B2Nozzle arrangements and supply channelsHEWLETT PACKARD DEVELOPMENT CO·Filed 2022·Granted Aug 1, 2023·2 cites·15 claims
- 1296US11141973B2Integrated circuits including memory cellsHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Oct 12, 2021·4 cites·22 claims
- 1395US10232619B2Printhead with bond pad surrounded by damHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Mar 19, 2019·5 cites·20 claims
- 1495US10226926B2Printbars and methods of forming printbarsHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Mar 12, 2019·4 cites·20 claims
- 1595US9731509B2Fluid structure with compression molded fluid channelHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2013·Granted Aug 15, 2017·10 cites·16 claims
- 1694US11046084B2Liquid level sensingHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Jun 29, 2021·6 cites·20 claims
- 1793US11559985B2Integrated circuit with address drivers for fluidic dieHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Jan 24, 2023·3 cites·13 claims
- 1893US11305537B2Nozzle arrangements and supply channelsHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Apr 19, 2022·4 cites·15 claims
- 1993US10245830B2Printing system with a fluid circulating elementHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted Apr 2, 2019·4 cites·15 claims
- 2092US11034151B2Nozzle arrangementsHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Jun 15, 2021·3 cites·20 claims
- 2192US10207500B2Print head interposersHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted Feb 19, 2019·3 cites·15 claims
- 2292US9919525B2Printed circuit board fluid ejection apparatusHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Mar 20, 2018·2 cites·20 claims
- 2392US9895888B2Fluid flow structureHEWLETT PACKARD DEVELOPMENT CO·Filed 2014·Granted Feb 20, 2018·5 cites·11 claims
- 2492US9751319B2Printing fluid cartridgeHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2016·Granted Sep 5, 2017·2 cites·19 claims
- 2592US8210654B2Fluid ejection device with electrodes to generate electric field within chamberWEI QINGQIAO·Filed 2010·Granted Jul 3, 2012·12 cites·12 claims
- 2691US11413864B2Die for a printheadHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Aug 16, 2022·3 cites·20 claims
- 2791US9770909B2Printhead dies molded with nozzle health sensorHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2014·Granted Sep 26, 2017·5 cites·20 claims
- 2890US12145360B2Integrated circuits including memory cellsHEWLETT PACKARD DEVELOPMENT CO·Filed 2023·Granted Nov 19, 2024·0 cites·20 claims
- 2990US11020967B2PrintheadHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Jun 1, 2021·2 cites·15 claims
- 3090US10940693B1Logic circuitryHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Mar 9, 2021·3 cites·28 claims
- 3190US9919524B2Printhead with bond pad surrounded by damHEWLETT PACKARD DEVELOPMENT CO·Filed 2013·Granted Mar 20, 2018·4 cites·19 claims
- 3289US11413865B2Fluid ejection devices including contact padsHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Aug 16, 2022·2 cites·14 claims
- 3389US10589522B2Fluidic dieHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Mar 17, 2020·2 cites·20 claims
- 3488US11969995B2Integrated circuits including memory cellsHEWLETT PACKARD DEVELOPMENT CO·Filed 2023·Granted Apr 30, 2024·0 cites·20 claims
- 3588US11577456B2Molded panelsHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Feb 14, 2023·2 cites·11 claims
- 3688US11292265B2Fluid circulation and ejectionHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Apr 5, 2022·2 cites·11 claims
- 3788US11292257B2Molded die slivers with exposed front and back surfacesHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Apr 5, 2022·1 cites·14 claims
- 3888US10739181B2Liquid level indicatingHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2018·Granted Aug 11, 2020·4 cites·20 claims
- 3988US9539814B2Molded printheadHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2013·Granted Jan 10, 2017·4 cites·14 claims
- 4086US11666908B2Microfluidic packageHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Jun 6, 2023·2 cites·20 claims
- 4186US11065883B2Cross-die recirculation channels and chamber recirculation channelsHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Jul 20, 2021·2 cites·20 claims
- 4286US8348373B2Firing signal forwarding in a fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2008·Granted Jan 8, 2013·8 cites·20 claims
- 4385US12097695B2Accessing registers of fluid ejection devicesHEWLETT PACKARD DEVELOPMENT CO·Filed 2023·Granted Sep 24, 2024·0 cites·19 claims
- 4485US11738562B2Logic circuitryHEWLETT PACKARD DEVELOPMENT CO·Filed 2022·Granted Aug 29, 2023·0 cites·20 claims
- 4585US11155086B2Fluidic ejection devices with enclosed cross-channelsHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Oct 26, 2021·2 cites·20 claims
- 4685US10576748B2Fluid reservoir with fluid property and level detectionHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Mar 3, 2020·2 cites·13 claims
- 4784US12391044B2Fluid ejection device with break(s) in cover layerHEWLETT PACKARD DEVELOPMENT CO·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 4884US12134274B2Molded structures with channelsHEWLETT PACKARD DEVELOPMENT CO·Filed 2023·Granted Nov 5, 2024·0 cites·16 claims
- 4984US11807005B2Nozzle arrangementsHEWLETT PACKARD DEVELOPMENT CO·Filed 2023·Granted Nov 7, 2023·0 cites·20 claims
- 5084US11186090B2Fluid ejection deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Nov 30, 2021·2 cites·19 claims
Showing the top 50 of 285 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →