Inventor · disambiguated record
Sung Kyu Lim
Also filed as: LIM SUNG KYU
6 granted patents·2 pending applications·29 citations·filing 2015–2015
77Inventor score
Files withQUALCOMM INC8
Top patents by PatentIndex Score
8 records- 0193US9741691B2Power delivery network (PDN) design for monolithic three-dimensional (3-D) integrated circuit (IC)QUALCOMM INC·Filed 2015·Granted Aug 22, 2017·14 cites·6 claims
- 0291US9256246B1Clock skew compensation with adaptive body biasing in three-dimensional (3D) integrated circuits (ICs) (3DICs)QUALCOMM INC·Filed 2015·Granted Feb 9, 2016·10 cites·25 claims
- 0374US9483598B2Intellectual property block design with folded blocks and duplicated pins for 3D integrated circuitsQUALCOMM INC·Filed 2015·Granted Nov 1, 2016·2 cites·21 claims
- 0473US9869713B2Through-silicon via (TSV) crack sensors for detecting TSV cracks in three-dimensional (3D) integrated circuits (ICs) (3DICs), and related methods and systemsQUALCOMM INC·Filed 2015·Granted Jan 16, 2018·2 cites·27 claims
- 0561US9508615B2Clock tree synthesis for low cost pre-bond testing of 3D integrated circuitsQUALCOMM INC·Filed 2015·Granted Nov 29, 2016·1 cites·20 claims
- 0638US9626311B2Memory controller placement in a three-dimensional (3D) integrated circuit (IC) (3DIC) employing distributed through-silicon-via (TSV) farmsQUALCOMM INC·Filed 2015·Granted Apr 18, 2017·0 cites·25 claims
- 0736US2016267214A1Clock tree design methods for ultra-wide voltage range circuitsQUALCOMM INC·Filed 2015·Application pending·0 cites
- 0835US2016042110A1High quality physical design for monolithic three-dimensional integrated circuits (3d ic) using two-dimensional integrated circuit (2d ic) design toolsQUALCOMM INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →