Inventor · disambiguated record
Chih-Kuai Yang
Also filed as: Yang Chih-Kuai
6 granted patents·5 citations·filing 2016–2019
71Inventor score
Top patents by PatentIndex Score
6 records- 0177US10002823B2Packaging substrate and method of fabricating the samePHOENIX & CORP·Filed 2017·Granted Jun 19, 2018·2 cites·5 claims
- 0271US9805996B2Substrate structure and manufacturing method thereofPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2016·Granted Oct 31, 2017·2 cites·4 claims
- 0364US9831217B2Method of fabricating package substratesPHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2017·Granted Nov 28, 2017·1 cites·10 claims
- 0455US11031329B2Method of fabricating packaging substratePHOENIX & CORP·Filed 2018·Granted Jun 8, 2021·0 cites·13 claims
- 0543US10896882B2Electronic package having heat dissipating element and method for fabricating the samePHOENIX & CORP·Filed 2019·Granted Jan 19, 2021·0 cites·18 claims
- 0642US10062649B2Package substratePHOENIX PIONEER TECHNOLOGY CO LTD·Filed 2016·Granted Aug 28, 2018·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →