Inventor · disambiguated record
Yasuharu Ohkawa
Also filed as: OHKAWA YASUHARU
3 granted patents·77 citations·filing 1998–2000
74Inventor score
Technology areasB24B
Files withSONY CORP3
Top patents by PatentIndex Score
3 records- 0187US6722962B1Polishing system, polishing method, polishing pad, and method of forming polishing padSONY CORP·Filed 2000·Granted Apr 20, 2004·35 cites·4 claims
- 0271US6139400APolishing system and method with polishing pad pressure adjustmentSONY CORP·Filed 1998·Granted Oct 31, 2000·31 cites·25 claims
- 0366US6520835B1Polishing system, polishing method, polishing pad, and method of forming polishing padSONY CORP·Filed 2000·Granted Feb 18, 2003·11 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →