Inventor · disambiguated record
Chong-Il Park
Also filed as: PARK CHONG-IL
5 granted patents·152 citations·filing 1990–1999
82Inventor score
Files withKYOCERA AMERICA INC5
Top patents by PatentIndex Score
5 records- 0184US6204448B1High frequency microwave packaging having a dielectric gapKYOCERA AMERICA INC·Filed 1998·Granted Mar 20, 2001·91 cites·10 claims
- 0263US6441697B1Ultra-low-loss feedthrough for microwave circuit packageKYOCERA AMERICA INC·Filed 1999·Granted Aug 27, 2002·32 cites·11 claims
- 0337US5137767APartially coated assembly structure and method for making a ceramic lid for hermetic sealing of an eprom circuitKYOCERA AMERICA INC·Filed 1990·Granted Aug 11, 1992·8 cites·10 claims
- 0436US5095360ACeramic chip-resistant chamfered integrated circuit packageKYOCERA AMERICA INC·Filed 1990·Granted Mar 10, 1992·12 cites·8 claims
- 0531US5160747AApparatus for manufacturing ceramic chip-resistant chamfered integrated circuit packageKYOCERA AMERICA INC·Filed 1991·Granted Nov 3, 1992·9 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →