Inventor · disambiguated record
Li-Lin Su
Also filed as: SU LI-LIN
20 granted patents·3 pending applications·72 citations·filing 2004–2024
93Inventor score
Top patents by PatentIndex Score
23 records- 0196US9530737B1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 27, 2016·15 cites·25 claims
- 0294US9614052B2Copper contact plugs with barrier layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 4, 2017·9 cites·17 claims
- 0390US7704886B2Multi-step Cu seed layer formation for improving sidewall coverageTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Apr 27, 2010·16 cites·19 claims
- 0489US11088020B2Structure and formation method of interconnection structure of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 10, 2021·7 cites·20 claims
- 0582US9136206B2Copper contact plugs with barrier layersSU LI-LIN·Filed 2012·Granted Sep 15, 2015·5 cites·19 claims
- 0681US9721894B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 1, 2017·2 cites·20 claims
- 0780US10534273B2Multi-metal fill with self-aligned patterning and dielectric with voidsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 14, 2020·2 cites·20 claims
- 0880US2024085803A1Multi-metal fill with self-aligned patterning and dielectric with voidsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0978US11860550B2Multi-metal fill with self-aligned patterning and dielectric with voidsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 2, 2024·0 cites·20 claims
- 1078US2024339406A1Integrated circuit interconnect structures with air gapsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1175US9589897B1Trench liner for removing impurities in a non-copper trenchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 7, 2017·2 cites·20 claims
- 1274US12062611B2Integrated circuit interconnect structures with air gapsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 13, 2024·0 cites·19 claims
- 1370US11251131B2Copper contact plugs with barrier layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 15, 2022·0 cites·20 claims
- 1469US8252690B2In situ Cu seed layer formation for improving sidewall coverageSU LI-LIN·Filed 2008·Granted Aug 28, 2012·3 cites·9 claims
- 1565US11422475B2Multi-metal fill with self-aligned patterning and dielectric with voidsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 23, 2022·0 cites·20 claims
- 1660US11244898B2Integrated circuit interconnect structures with air gapsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 8, 2022·0 cites·20 claims
- 1760US7253501B2High performance metallization cap layerTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Aug 7, 2007·9 cites·13 claims
- 1858US10700010B2Copper contact plugs with barrier layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 30, 2020·0 cites·22 claims
- 1957US11127680B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 21, 2021·0 cites·20 claims
- 2054US9935006B2Trench liner for removing impurities in a non-copper trenchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 3, 2018·0 cites·20 claims
- 2153US8034709B2Method for forming composite barrier layerTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Oct 11, 2011·0 cites·13 claims
- 2246US7453149B2Composite barrier layerTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Nov 18, 2008·2 cites·15 claims
- 2339US2005189075A1Pre-clean chamber with wafer heating apparatus and method of useTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →