Inventor · disambiguated record
David Trung Doan
Also filed as: DOAN DAVID · DOAN DAVID T · DOAN DAVID TRUNG
20 granted patents·8 pending applications·42 citations·filing 2008–2024
93Inventor score
Top patents by PatentIndex Score
28 records- 0198US11817536B2Method for making electronic device arrays using a temporary substrate and a carrier substrateSEMILEDS OPTOELECTRONICS CO·Filed 2022·Granted Nov 14, 2023·4 cites·16 claims
- 0297US11387397B2Method for making light emitting device (LED) arrays using a temporary substrate and a carrier substrateSEMILEDS OPTOELECTRONICS CO·Filed 2020·Granted Jul 12, 2022·3 cites·16 claims
- 0396US11417799B2Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plateSEMILEDS CORP·Filed 2020·Granted Aug 16, 2022·4 cites·20 claims
- 0492US11728461B2Single light emitting diode (LED) structure having epitaxial structure separated into light emitting zonesSEMILEDS OPTOELECTRONICS CO·Filed 2020·Granted Aug 15, 2023·2 cites·12 claims
- 0590US10910535B2Method for making light emitting device LED arraysSEMILEDS OPTOELECTRONICS CO·Filed 2018·Granted Feb 2, 2021·4 cites·14 claims
- 0688US2025143048A1Method for making electronic device arrays using a temporary substrateSEMILEDS OPTOELECTRONICS CO·Filed 2024·Application pending·0 cites
- 0786US2024072203A1Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving PlateSEMILEDS CORP·Filed 2023·Application pending·0 cites
- 0885US11545474B2Method and system for transferring alignment marks between substrate systemsSEMILEDS CORP·Filed 2021·Granted Jan 3, 2023·1 cites·13 claims
- 0985US10215387B2Acoustic-control light fixture and method for making and usingHEILUX LLC·Filed 2017·Granted Feb 26, 2019·4 cites·20 claims
- 1085US7902004B2ESD induced artifact reduction design for a thin film transistor image sensor arrayDPIX LLC·Filed 2008·Granted Mar 8, 2011·12 cites·30 claims
- 1185US2024063339A1Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving PlateSAMILEDS CORP·Filed 2023·Application pending·0 cites
- 1284US12191434B2Method for making electronic device arrays using a temporary substrateSEMILEDS OPTOELECTRONICS CO·Filed 2023·Granted Jan 7, 2025·0 cites·15 claims
- 1384US10595469B2Lighting fixture and method for making and usingGROW LITES LLC·Filed 2017·Granted Mar 24, 2020·4 cites·21 claims
- 1481US11862755B2Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plateSEMILEDS CORP·Filed 2022·Granted Jan 2, 2024·0 cites·5 claims
- 1580US12206051B2Light emitting diode (LED) structure having single epitaxial structure separated into light emitting zonesSEMILEDS OPTOELECTRONICS CO·Filed 2023·Granted Jan 21, 2025·0 cites·12 claims
- 1680US11862754B2Method for fabricating (LED) dice using semiconductor structures on a substrate and laser lift-off to a receiving plateSEMILEDS CORP·Filed 2022·Granted Jan 2, 2024·0 cites·4 claims
- 1780US10964851B2Single light emitting diode (LED) structureSEMILEDS OPTOELECTRONICS CO·Filed 2018·Granted Mar 30, 2021·2 cites·18 claims
- 1879US10779478B2Method and apparatus for an acoustic-control light fixtureHEILUX LLC·Filed 2019·Granted Sep 22, 2020·2 cites·21 claims
- 1972US12426410B2Semiconductor components and semiconductor structures and methods of fabricationTSLC CORP·Filed 2020·Granted Sep 23, 2025·0 cites·22 claims
- 2072US12002792B2Method and system for transferring alignment marks between substrate systemsSEMILEDS CORP·Filed 2022·Granted Jun 4, 2024·0 cites·18 claims
- 2161US2021000019A1Lighting fixture and methodGROW LITES LLC·Filed 2020·Application pending·0 cites
- 2260US12364079B2Method for making light emitting device (LED) arrays and electronic products using a temporary substrate and a carrier substrateSEMILEDS OPTOELECTRONICS CO·Filed 2022·Granted Jul 15, 2025·0 cites·15 claims
- 2355US2022320366A1Method To Remove An Isolation Layer On The Corner Between The Semiconductor Light Emitting Device To The Growth SubstrateSEMILEDS CORP·Filed 2022·Application pending·0 cites
- 2454US2011127534A1ESD Induced Artifact Reduction Design for a Thin Film Transistor Image Sensor ArrayWEISFIELD RICHARD·Filed 2011·Application pending·0 cites
- 2553US2023018855A1Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving PlateSEMILEDS CORP·Filed 2022·Application pending·0 cites
- 2649US9130114B2Vertical light emitting diode (VLED) dice having confinement layers with roughened surfaces and methods of fabricationSEMILEDS OPTOELECTRONICS CO·Filed 2013·Granted Sep 8, 2015·0 cites·15 claims
- 2748US2013240834A1Method for fabricating vertical light emitting diode (vled) dice with wavelength conversion layersSEMILEDS OPTOELECTRONICS CO·Filed 2013·Application pending·0 cites
- 2843US9343639B2Light emitting diode (LED) device having lens protective structure and method of fabricationSEMILEDS OPTOELECTRONICS CO·Filed 2013·Granted May 17, 2016·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →