Inventor · disambiguated record
Raymond Jao
Also filed as: JAO RAYMOND · JAO RAYMOND J M
3 granted patents·190 citations·filing 1999–2001
77Inventor score
Top patents by PatentIndex Score
3 records- 0187US6114752ASemiconductor package having lead frame with an exposed base padSILICONWARE PRECISION IND CO L·Filed 1999·Granted Sep 5, 2000·115 cites·15 claims
- 0286US6555296B2Fine pitch wafer bumping processSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Apr 29, 2003·44 cites·15 claims
- 0378US6770959B2Semiconductor package without substrate and method of manufacturing sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Aug 3, 2004·31 cites·14 claims
Join the waitlist — get patent alerts
Get an alert when Raymond Jao files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →