Inventor · disambiguated record
Yasuaki Seki
Also filed as: SEKI YASUAKI
4 granted patents·1 pending application·54 citations·filing 1999–2013
75Inventor score
Top patents by PatentIndex Score
5 records- 0178US6613987B2Insulating resin composition for multilayer printed-wiring boardAJINOMOTO KK·Filed 2000·Granted Sep 2, 2003·26 cites·14 claims
- 0274US6710260B1Printed circuit board and manufacturing method of the printed circuit boardVICTOR COMPANY OF JAPAN·Filed 2000·Granted Mar 23, 2004·20 cites·1 claims
- 0339US9756732B2Device embedded substrate and manufacturing method of device embedded substrateMEIKO ELECTRONICS CO LTD·Filed 2013·Granted Sep 5, 2017·0 cites·9 claims
- 0437US6284308B2Manufacturing method of printed circuit boardVICTOR COMPANY OF JAPAN·Filed 1999·Granted Sep 4, 2001·8 cites·4 claims
- 0534US2002001699A1Manufacturing method of printed circuit boardVICTOR COMPANY OF JAPAN·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →