Inventor · disambiguated record
Nathapong Suthiwongsunthorn
Also filed as: SUTHIWONGSUNTHORN NATHAPONG
37 granted patents·599 citations·filing 2008–2018
98Inventor score
Files withSTATS CHIPPAC LTD13UTAC HEADQUARTERS PTE LTD8MARIMUTHU PANDI CHELVAM2NG CATHERINE BEE LIANG2PAGAILA REZA A2
Top patents by PatentIndex Score
37 records- 0198US8349735B2Semiconductor device and method of forming conductive TSV with insulating annular ringSTATS CHIPPAC LTD·Filed 2010·Granted Jan 8, 2013·44 cites·25 claims
- 0298US7838337B2Semiconductor device and method of forming an interposer package with through silicon viasSTATS CHIPPAC LTD·Filed 2008·Granted Nov 23, 2010·166 cites·20 claims
- 0397US8263439B2Semiconductor device and method of forming an interposer package with through silicon viasMARIMUTHU PANDI CHELVAM·Filed 2010·Granted Sep 11, 2012·91 cites·31 claims
- 0497US7741148B1Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural supportSTATS CHIPPAC LTD·Filed 2008·Granted Jun 22, 2010·57 cites·17 claims
- 0596US8017515B2Semiconductor device and method of forming compliant polymer layer between UBM and conformal dielectric layer/RDL for stress reliefSTATS CHIPPAC LTD·Filed 2008·Granted Sep 13, 2011·49 cites·24 claims
- 0693US8659162B2Semiconductor device having an interconnect structure with TSV using encapsulant for structural supportSUTHIWONGSUNTHORN NATHAPONG·Filed 2011·Granted Feb 25, 2014·19 cites·25 claims
- 0793US8067308B2Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural supportSUTHIWONGSUNTHORN NATHAPONG·Filed 2009·Granted Nov 29, 2011·28 cites·27 claims
- 0890US9978658B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2016·Granted May 22, 2018·8 cites·18 claims
- 0990US8907498B2Semiconductor device and method of forming a shielding layer between stacked semiconductor dieSTATS CHIPPAC LTD·Filed 2012·Granted Dec 9, 2014·8 cites·25 claims
- 1090US8716873B2Semiconductor packages and methods of packaging semiconductor devicesWANG CHUEN KHIANG·Filed 2011·Granted May 6, 2014·19 cites·27 claims
- 1190US8378383B2Semiconductor device and method of forming a shielding layer between stacked semiconductor dieSTATS CHIPPAC LTD·Filed 2009·Granted Feb 19, 2013·15 cites·26 claims
- 1290US7863721B2Method and apparatus for wafer level integration using tapered viasSTATS CHIPPAC LTD·Filed 2008·Granted Jan 4, 2011·19 cites·25 claims
- 1389US9842775B2Semiconductor device and method of forming a thin wafer without a carrierSTATS CHIPPAC PTE LTD·Filed 2016·Granted Dec 12, 2017·5 cites·16 claims
- 1488US9136142B2Semiconductor packages and methods of packaging semiconductor devicesUNITED TEST & ASSEMBLY CT LT·Filed 2014·Granted Sep 15, 2015·7 cites·24 claims
- 1585US9508623B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2015·Granted Nov 29, 2016·5 cites·31 claims
- 1684US9236352B2Semiconductor die and method of forming noise absorbing regions between THVs in peripheral region of the diePAGAILA REZA A·Filed 2011·Granted Jan 12, 2016·6 cites·32 claims
- 1782US9054083B2Semiconductor device and method of making TSV interconnect structures using encapsulant for structural supportSTATS CHIPPAC LTD·Filed 2013·Granted Jun 9, 2015·4 cites·25 claims
- 1881US8829666B2Semiconductor packages and methods of packaging semiconductor devicesNG CATHERINE BEE LIANG·Filed 2011·Granted Sep 9, 2014·8 cites·20 claims
- 1980US9583446B2Semiconductor device and method of forming a shielding layer between stacked semiconductor dieSTATS CHIPPAC LTD·Filed 2014·Granted Feb 28, 2017·3 cites·29 claims
- 2079US9589875B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2015·Granted Mar 7, 2017·2 cites·20 claims
- 2179US9029193B2Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural supportMARIMUTHU PANDI CHELVAM·Filed 2010·Granted May 12, 2015·4 cites·23 claims
- 2278US8125073B2Wafer integrated with permanent carrier and method thereforHAN BYUNG JOON·Filed 2011·Granted Feb 28, 2012·4 cites·33 claims
- 2377US7880293B2Wafer integrated with permanent carrier and method thereforSTATS CHIPPAC LTD·Filed 2008·Granted Feb 1, 2011·6 cites·25 claims
- 2476US9570314B2Methods for singulating semiconductor waferUTAC HEADQUARTERS PTE LTD·Filed 2015·Granted Feb 14, 2017·3 cites·20 claims
- 2573US10381280B2Semiconductor packages and methods for forming semiconductor packageUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Aug 13, 2019·2 cites·23 claims
- 2673US9613877B2Semiconductor packages and methods for forming semiconductor packageUNITED TEST AND ASSEMBLY CENTER LTD·Filed 2013·Granted Apr 4, 2017·4 cites·18 claims
- 2773US9443762B2Semiconductor device and method of forming a thin wafer without a carrierSTATS CHIPPAC LTD·Filed 2013·Granted Sep 13, 2016·2 cites·23 claims
- 2872US8531015B2Semiconductor device and method of forming a thin wafer without a carrierMARIMUTHU PANDI C·Filed 2009·Granted Sep 10, 2013·5 cites·28 claims
- 2971US8049328B2Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural supportSTATS CHIPPAC LTD·Filed 2010·Granted Nov 1, 2011·2 cites·25 claims
- 3068US8093151B2Semiconductor die and method of forming noise absorbing regions between THVS in peripheral region of the diePAGAILA REZA A·Filed 2009·Granted Jan 10, 2012·3 cites·32 claims
- 3157US8860079B2Semiconductor packages and methods of packaging semiconductor devicesNG CATHERINE BEE LIANG·Filed 2012·Granted Oct 14, 2014·1 cites·20 claims
- 3256US9881863B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Jan 30, 2018·0 cites·20 claims
- 3355US10354934B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2018·Granted Jul 16, 2019·0 cites·11 claims
- 3454US8703610B2Semiconductor device and method of forming conductive TSV with insulating annular ringSTATS CHIPPAC LTD·Filed 2012·Granted Apr 22, 2014·0 cites·25 claims
- 3546US9741619B2Methods for singulating semiconductor waferUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Aug 22, 2017·0 cites·20 claims
- 3646US9472532B2Leadframe area array packaging technologyUNITED TEST AND ASSEMBLY CENTER LTD·Filed 2015·Granted Oct 18, 2016·0 cites·24 claims
- 3743US9023690B2Leadframe area array packaging technologyDIMAANO JR ANTONIO BAMBALAN·Filed 2012·Granted May 5, 2015·0 cites·23 claims
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