Inventor · disambiguated record
Jeremy J. Schmitz
Also filed as: SCHMITZ JEREMY J
2 granted patents·1 pending application·14 citations·filing 2011–2014
58Inventor score
Top patents by PatentIndex Score
3 records- 0183US8430264B2Method for packaging thermal interface materialsJEWRAM RADESH·Filed 2011·Granted Apr 30, 2013·8 cites·5 claims
- 0274US9693481B2Thermally conductive dielectric interfaceHenkel IP & Holding GmbH·Filed 2014·Granted Jun 27, 2017·6 cites·14 claims
- 0346US2013221014A1Method for Packaging Thermal Interface MaterialsBERGQUIST CO·Filed 2013·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →