Assignee
BERGQUIST CO
US·30 granted patents·2 pending applications·1,619 citations·filing 1983–2013
Top patents by PatentIndex Score
32 records- 0193US6197859B1Thermally conductive interface pads for electronic devicesBERGQUIST CO·Filed 1998·Granted Mar 6, 2001·104 cites·4 claims
- 0291US6898084B2Thermal diffusion apparatusBERGQUIST CO·Filed 2003·Granted May 24, 2005·66 cites·9 claims
- 0391US6657297B1Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface padsBERGQUIST CO·Filed 2002·Granted Dec 2, 2003·89 cites·13 claims
- 0491US6339120B1Method of preparing thermally conductive compounds by liquid metal bridged particle clustersBERGQUIST CO·Filed 2000·Granted Jan 15, 2002·59 cites·7 claims
- 0591US6165612AThermally conductive interface layersBERGQUIST CO·Filed 1999·Granted Dec 26, 2000·124 cites·11 claims
- 0691US4810563AThermally conductive, electrically insulative laminateBERGQUIST CO·Filed 1987·Granted Mar 7, 1989·129 cites·34 claims
- 0791US4602678AInterfacing of heat sinks with electrical devices, and the likeBERGQUIST CO·Filed 1983·Granted Jul 29, 1986·88 cites·7 claims
- 0889US5679457AThermally conductive interface for electronic devicesBERGQUIST CO·Filed 1996·Granted Oct 21, 1997·114 cites·13 claims
- 0988US6624224B1Method of preparing thermally conductive compounds by liquid metal bridged particle clustersBERGQUIST CO·Filed 2000·Granted Sep 23, 2003·41 cites·6 claims
- 1088US4574879AMounting pad for solid-state devicesBERGQUIST CO·Filed 1984·Granted Mar 11, 1986·85 cites·5 claims
- 1187US4685987AMethod of preparing interfacings of heat sinks with electrical devicesBERGQUIST CO·Filed 1986·Granted Aug 11, 1987·90 cites·9 claims
- 1286US7760507B2Thermally and electrically conductive interconnect structuresBERGQUIST CO·Filed 2007·Granted Jul 20, 2010·15 cites·20 claims
- 1386US4842911AInterfacing for heat sinksBERGQUIST CO·Filed 1988·Granted Jun 27, 1989·82 cites·7 claims
- 1484US6797758B2Morphing fillers and thermal interface materialsBERGQUIST CO·Filed 2001·Granted Sep 28, 2004·49 cites·6 claims
- 1584US6090484AThermally conductive filled polymer composites for mounting electronic devices and method of applicationBERGQUIST CO·Filed 1997·Granted Jul 18, 2000·94 cites·3 claims
- 1683US6399209B1Integrated release films for phase-change interfacesBERGQUIST CO·Filed 2000·Granted Jun 4, 2002·42 cites·11 claims
- 1780USRE39992EMorphing fillers and thermal interface materialsBERGQUIST CO·Filed 2005·Granted Jan 1, 2008·12 cites·11 claims
- 1879US5950066ASemisolid thermal interface with low flow resistanceBERGQUIST CO·Filed 1996·Granted Sep 7, 1999·80 cites·17 claims
- 1979US4602125AMounting pad with tubular projections for solid-state devicesBERGQUIST CO·Filed 1985·Granted Jul 22, 1986·57 cites·2 claims
- 2075US6984685B2Thermal interface pad utilizing low melting metal with retention matrixBERGQUIST CO·Filed 2002·Granted Jan 10, 2006·26 cites·6 claims
- 2174US6649325B1Thermally conductive dielectric mounts for printed circuitry and semi-conductor devices and method of preparationBERGQUIST CO·Filed 2001·Granted Nov 18, 2003·23 cites·10 claims
- 2267US6559835B1Touch screen superimposed electrode configurationBERGQUIST CO·Filed 2001·Granted May 6, 2003·18 cites·3 claims
- 2365US6650215B1Finned heat sinksBERGQUIST CO·Filed 2002·Granted Nov 18, 2003·13 cites·1 claims
- 2464US4755249AMounting base pad means for semiconductor devices and method of preparing sameBERGQUIST CO·Filed 1986·Granted Jul 5, 1988·32 cites·3 claims
- 2562US4666545AMethod of making a mounting base pad for semiconductor devicesBERGQUIST CO·Filed 1984·Granted May 19, 1987·25 cites·2 claims
- 2660US6424339B1Touch screen assemblyBERGQUIST CO·Filed 2000·Granted Jul 23, 2002·10 cites·5 claims
- 2753US2015140411A1Battery Cell CoatingsBERGQUIST CO·Filed 2013·Application pending·0 cites
- 2851US6611256B1Touch screen dielectric separatorsBERGQUIST CO·Filed 2001·Granted Aug 26, 2003·4 cites·2 claims
- 2946US5463530ADual sided laminated semiconductor mountingBERGQUIST CO·Filed 1994·Granted Oct 31, 1995·16 cites·20 claims
- 3046US4853763AMounting base pad means for semiconductor devices and method of preparing sameBERGQUIST CO·Filed 1986·Granted Aug 1, 1989·15 cites·4 claims
- 3146US2013221014A1Method for Packaging Thermal Interface MaterialsBERGQUIST CO·Filed 2013·Application pending·0 cites
- 3241US5588673AMembrane switch for use over a steering wheel airbag assemblyBERGQUIST CO·Filed 1994·Granted Dec 31, 1996·17 cites·18 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →