Inventor · disambiguated record
Noriyoshi Hosono
Also filed as: HOSONO NORIYOSHI
2 granted patents·1 pending application·23 citations·filing 2006–2010
60Inventor score
Technology areasH10P
Top patents by PatentIndex Score
3 records- 0190US7875501B2Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structureSHINETSU POLYMER CO·Filed 2007·Granted Jan 25, 2011·19 cites·6 claims
- 0273US8212345B2Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structureTANAKA KIYOFUMI·Filed 2010·Granted Jul 3, 2012·4 cites·15 claims
- 0338US2006243620A1Fixing carrier, fixing carrier manufacturing method, method of using fixing carriers and substrate storage containerSHINETSU POLYMER CO·Filed 2006·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →