Inventor · disambiguated record
Robert L. Borwick, Iii
Also filed as: BORWICK III ROBERT L · BORWICK III ROBERT LADD · BORWICK ROBERT L · BORWICK ROBERT L III
26 granted patents·3 pending applications·338 citations·filing 2002–2017
96Inventor score
Files withTELEDYNE SCIENT & IMAGING LLC8TELEDYNE LICENSING LLC7DENATALE JEFFREY F3ROCKWELL SCIENT LICENSING LLC3STUPAR PHILIP A2
Top patents by PatentIndex Score
29 records- 0192US8319156B2System for heating a vapor cellBORWICK III ROBERT L·Filed 2009·Granted Nov 27, 2012·46 cites·20 claims
- 0292US8258884B2System for charging a vapor cellBORWICK ROBERT L III·Filed 2009·Granted Sep 4, 2012·62 cites·17 claims
- 0392US7303935B2High temperature microelectromechanical (MEM) devices and fabrication methodTELEDYNE LICENSING LLC·Filed 2005·Granted Dec 4, 2007·20 cites·4 claims
- 0491US7619485B2Compact optical assembly for chip-scale atomic clockTELEDYNE SCIENT & IMAGING LLC·Filed 2007·Granted Nov 17, 2009·24 cites·37 claims
- 0589US6979872B2Modules integrating MEMS devices with pre-processed electronic circuitry, and methods for fabricating such modulesROCKWELL SCIENT LICENSING LLC·Filed 2003·Granted Dec 27, 2005·50 cites·13 claims
- 0687US8080736B2Non-planar microcircuit structure and method of fabricating sameDENATALE JEFFREY F·Filed 2009·Granted Dec 20, 2011·15 cites·29 claims
- 0786US7328604B2Microelectromechanical (MEM) fluid health sensing device and fabrication methodTELEDYNE LICENSING LLC·Filed 2005·Granted Feb 12, 2008·10 cites·47 claims
- 0885US8826514B2Microfabricated inductors with through-wafer viasPAPAVASILIOU ALEXANDROS·Filed 2011·Granted Sep 9, 2014·10 cites·16 claims
- 0983US7810379B2High temperature microelectromechanical (MEM) devicesROCKWELL SCIENT LICENSING LLC·Filed 2007·Granted Oct 12, 2010·8 cites·20 claims
- 1082US10325707B2Integrated field coil for compact atomic devicesTELEDYNE SCIENT & IMAGING LLC·Filed 2017·Granted Jun 18, 2019·2 cites·20 claims
- 1182US7346981B2Method for fabricating microelectromechanical system (MEMS) devicesTELEDYNE LICENSING LLC·Filed 2003·Granted Mar 25, 2008·25 cites·29 claims
- 1281US8088667B2Method of fabricating vertical capacitors in through-substrate viasDENATALE JEFFREY F·Filed 2008·Granted Jan 3, 2012·10 cites·40 claims
- 1381US7538032B2Low temperature method for fabricating high-aspect ratio vias and devices fabricated by said methodTELEDYNE SCIENT & IMAGING LLC·Filed 2005·Granted May 26, 2009·12 cites·20 claims
- 1480US7287415B2Microelectromechanical system (MEMS) viscosity sensor for fluid health monitoringTELEDYNE LICENSING LLC·Filed 2004·Granted Oct 30, 2007·17 cites·24 claims
- 1577US7329932B2Microelectromechanical (MEM) viscosity sensor and methodTELEDYNE LICENSING LLC·Filed 2005·Granted Feb 12, 2008·5 cites·43 claims
- 1675US8937513B2Micro-scale system to provide thermal isolation and electrical communication between substratesTELEDYNE SCIENT & IMAGING LLC·Filed 2013·Granted Jan 20, 2015·1 cites·17 claims
- 1769US7735362B2Thermomechanical sensor for fluid diagnosticsTELEDYNE LICENSING LLC·Filed 2006·Granted Jun 15, 2010·2 cites·9 claims
- 1868US8614610B2Ruggedized waveguide encapsulation fixture for receiving a compressed waveguide componentHACKER JONATHAN·Filed 2010·Granted Dec 24, 2013·3 cites·20 claims
- 1965US8456249B2Micro-scale system to provide thermal isolation and electrical communication between substratesDENATALE JEFFREY F·Filed 2011·Granted Jun 4, 2013·1 cites·24 claims
- 2065US7261430B1Thermal and intrinsic stress compensated micromirror apparatus and methodTELEDYNE LICENSING LLC·Filed 2006·Granted Aug 28, 2007·3 cites·22 claims
- 2161US8995800B2Method of fabricating silicon waveguides with embedded active circuitrySTUPAR PHILIP A·Filed 2012·Granted Mar 31, 2015·1 cites·16 claims
- 2260US6771081B2Liquid-medium immersed MEMs devicesROCKWELL SCIENT LICENSING LLC·Filed 2002·Granted Aug 3, 2004·10 cites·17 claims
- 2356US10416246B2Physics package for compact atomic deviceTELEDYNE SCIENT & IMAGING LLC·Filed 2017·Granted Sep 17, 2019·0 cites·21 claims
- 2456US8187972B2Through-substrate vias with polymer fill and method of fabricating sameSTUPAR PHILIP A·Filed 2011·Granted May 29, 2012·1 cites·17 claims
- 2552US2010225436A1Microfabricated inductors with through-wafer viasTELEDYNE SCIENT & IMAGING LLC·Filed 2009·Application pending·0 cites
- 2650US2015185416A1Silicon waveguides with embedded active circuitryTELEDYNE SCIENT & IMAGING LLC·Filed 2015·Application pending·0 cites
- 2746US9607748B2Micro-fabricated integrated coil and magnetic circuit and method of manufacturing thereofTELEDYNE SCIENT & IMAGING LLC·Filed 2014·Granted Mar 28, 2017·0 cites·16 claims
- 2837US2004027029A1Lorentz force microelectromechanical system (MEMS) and a method for operating such a MEMSINNOVATIVE TECHOLOGY LICENSING·Filed 2002·Application pending·0 cites
- 2936US8654332B2Chip-scale optics module for optical interrogatorsBORWICK ROBERT L·Filed 2011·Granted Feb 18, 2014·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →