Inventor · disambiguated record
Harry Hedler
Also filed as: HEDLER HARRY
90 granted patents·32 pending applications·1,585 citations·filing 2000–2015
99Inventor score
Top patents by PatentIndex Score
122 records- 0198US7208345B2Method of manufacturing a semiconductor device comprising stacked chips and a corresponding semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2005·Granted Apr 24, 2007·101 cites·7 claims
- 0297US6727576B2Transfer wafer level packagingINFINEON TECHNOLOGIES AG·Filed 2001·Granted Apr 27, 2004·168 cites·16 claims
- 0396US7960843B2Chip arrangement and method of manufacturing a chip arrangementQIMONDA AG·Filed 2009·Granted Jun 14, 2011·54 cites·13 claims
- 0495US8012807B2Method for producing chip packages, and chip package produced in this wayINFINEON TECHNOLOGIES AG·Filed 2007·Granted Sep 6, 2011·23 cites·21 claims
- 0595US7829380B2Solder pillar bumping and a method of making the sameQIMONDA AG·Filed 2006·Granted Nov 9, 2010·36 cites·70 claims
- 0695US6936928B2Semiconductor component and method for its productionINFINEON TECHNOLOGIES AG·Filed 2002·Granted Aug 30, 2005·107 cites·16 claims
- 0795US6845554B2Method for connection of circuit unitsINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jan 25, 2005·114 cites·7 claims
- 0894US8048479B2Method for placing material onto a target board by means of a transfer boardQIMONDA AG·Filed 2006·Granted Nov 1, 2011·34 cites·21 claims
- 0994US7326592B2Stacked die packageINFINEON TECHNOLOGIES AG·Filed 2005·Granted Feb 5, 2008·54 cites·19 claims
- 1094US6714418B2Method for producing an electronic component having a plurality of chips that are stacked one above the other and contact-connected to one anotherINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 30, 2004·89 cites·26 claims
- 1192US9650569B1Method of manufacturing garnet interfaces and articles containing the garnets obtained therefromSIEMENS MEDICAL SOLUTIONS USA INC·Filed 2015·Granted May 16, 2017·8 cites·27 claims
- 1290US6897568B2Electronic component with flexible contacting pads and method for producing the electronic componentINFINEON TECHNOLOGIES AG·Filed 2002·Granted May 24, 2005·52 cites·19 claims
- 1389US7545048B2Stacked die packageINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jun 9, 2009·18 cites·20 claims
- 1488US7663248B2Flip-chip componentINFINEON TECHNOLOGIES AG·Filed 2005·Granted Feb 16, 2010·17 cites·19 claims
- 1588US7605019B2Semiconductor device with stacked chips and method for manufacturing thereofQIMONDA AG·Filed 2006·Granted Oct 20, 2009·22 cites·16 claims
- 1687US9097808B2Radiation detector and imaging systemHEDLER HARRY·Filed 2012·Granted Aug 4, 2015·9 cites·11 claims
- 1787US8188585B2Electronic device and method for producing a deviceBRUNNBAUER MARKUS·Filed 2007·Granted May 29, 2012·10 cites·28 claims
- 1886US8004072B2Packaging systems and methodsQIMONDA AG·Filed 2008·Granted Aug 23, 2011·17 cites·14 claims
- 1986US7948071B2Integrated circuit with re-route layer and stacked die assemblyQIMONDA AG·Filed 2008·Granted May 24, 2011·13 cites·44 claims
- 2086US7074696B1Semiconductor circuit module and method for fabricating semiconductor circuit modulesINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jul 11, 2006·43 cites·9 claims
- 2185US7037761B2Method of producing an electronic componentINFINEON TECHNOLOGIES AG·Filed 2005·Granted May 2, 2006·13 cites·15 claims
- 2285US6664176B2Method of making pad-rerouting for integrated circuit chipsINFINEON TECHNOLOGIES AG·Filed 2001·Granted Dec 16, 2003·43 cites·29 claims
- 2383US7919868B2Carrier substrate and integrated circuitQIMONDA AG·Filed 2007·Granted Apr 5, 2011·10 cites·19 claims
- 2483US7365438B2Semiconductor device with semiconductor components connected to one anotherINFINEON TECHNOLOGIES AG·Filed 2005·Granted Apr 29, 2008·11 cites·10 claims
- 2582US7247948B2Semiconductor device and method for fabricating the semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jul 24, 2007·31 cites·6 claims
- 2681US7342320B2Electronic component with semiconductor chips, electronic assembly composed of stacked semiconductor chips, and methods for producing an electronic component and an electronic assemblyINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 11, 2008·28 cites·12 claims
- 2781US7221053B2Integrated device and electronic systemINFINEON TECHNOLOGIES AG·Filed 2005·Granted May 22, 2007·9 cites·34 claims
- 2881US6953708B2Method of producing a semiconductor component having a compliant buffer layerINFINEON TECHNOLOGIES AG·Filed 2003·Granted Oct 11, 2005·30 cites·26 claims
- 2981US6851598B2Electronic component with a semiconductor chip and method for producing the electronic componentINFINEON TECHNOLOGIES AG·Filed 2002·Granted Feb 8, 2005·27 cites·25 claims
- 3080US8350364B2Electronic component with semiconductor chips, electronic assembly composed of stacked semiconductor chips, and methods for producing an electronic component and an electronic assemblyQIMONDA AG·Filed 2007·Granted Jan 8, 2013·8 cites·11 claims
- 3180US7928590B2Integrated circuit package with a heat dissipation deviceQIMONDA AG·Filed 2006·Granted Apr 19, 2011·9 cites·15 claims
- 3280US7911068B2Component and method for producing a componentINFINEON TECHNOLOGIES AG·Filed 2006·Granted Mar 22, 2011·8 cites·14 claims
- 3380US7884488B2Semiconductor component with improved contact pad and method for forming the sameQIMONDA AG·Filed 2008·Granted Feb 8, 2011·8 cites·29 claims
- 3479US7422930B2Integrated circuit with re-route layer and stacked die assemblyINFINEON TECHNOLOGIES AG·Filed 2004·Granted Sep 9, 2008·25 cites·60 claims
- 3579US6555415B2Electronic configuration with flexible bonding padsINFINEON TECHNOLOGIES AG·Filed 2001·Granted Apr 29, 2003·28 cites·14 claims
- 3676US7312533B2Electronic component with flexible contacting pads and method for producing the electronic componentINFINEON TECHNOLOGIES AG·Filed 2004·Granted Dec 25, 2007·19 cites·38 claims
- 3776US6638870B2Forming a structure on a waferINFINEON TECHNOLOGIES AG·Filed 2002·Granted Oct 28, 2003·22 cites·21 claims
- 3875US7274110B2Semiconductor component having a CSP housingINFINEON TECHNOLOGIES AG·Filed 2005·Granted Sep 25, 2007·6 cites·16 claims
- 3974US8912654B2Semiconductor chip with integrated viaKREUPL FRANZ·Filed 2008·Granted Dec 16, 2014·4 cites·32 claims
- 4074US7274107B2Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2005·Granted Sep 25, 2007·6 cites·18 claims
- 4174US7217646B2Method for connecting an integrated circuit to a substrate and corresponding circuit arrangementINFINEON TECHNOLOGIES AG·Filed 2005·Granted May 15, 2007·6 cites·10 claims
- 4274US6852931B2Configuration having an electronic device electrically connected to a printed circuit boardINFINEON TECHNOLOGIES AG·Filed 2002·Granted Feb 8, 2005·19 cites·27 claims
- 4373US7080988B2Flexible contact-connection deviceINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jul 25, 2006·5 cites·10 claims
- 4473US6744127B2Semiconductor chip, memory module and method for testing the semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jun 1, 2004·20 cites·3 claims
- 4572US6919232B2Process for producing a semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jul 19, 2005·18 cites·19 claims
- 4670US7514273B2Method for applying rewiring to a panel while compensating for position errors of semiconductor chips in component positions of the panelQIMONDA AG·Filed 2004·Granted Apr 7, 2009·12 cites·23 claims
- 4770US6858799B2Electronic component with a semiconductor chip and method of producing the electronic componentINFINEON TECHNOLOGIES AG·Filed 2002·Granted Feb 22, 2005·15 cites·13 claims
- 4870US6756540B2Self-adhering chipINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jun 29, 2004·16 cites·19 claims
- 4969US6979591B2Connection of integrated circuitsINFINEON TECHNOLOGIES AG·Filed 2003·Granted Dec 27, 2005·16 cites·9 claims
- 5068US8742563B2Component and method for producing a componentMEYER THORSTEN·Filed 2010·Granted Jun 3, 2014·2 cites·16 claims
Showing the top 50 of 122 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →