Inventor · disambiguated record
Durodami Lisk
Also filed as: LISK DURODAMI · LISK DURODAMI J · LISK DURODAMI JOSCELYN
6 granted patents·12 pending applications·9 citations·filing 2010–2024
71Inventor score
Top patents by PatentIndex Score
18 records- 0189US12062648B2Multiple (multi-) die integrated circuit (IC) packages for supporting higher connection density, and related fabrication methodsQUALCOMM INC·Filed 2021·Granted Aug 13, 2024·2 cites·33 claims
- 0279US9136202B2Enhanced package thermal management using external and internal capacitive thermal materialCHIRIAC VICTOR A·Filed 2012·Granted Sep 15, 2015·7 cites·13 claims
- 0370US12512401B2Integrated device substrate including embedded electromagnetic isolation structureQUALCOMM INC·Filed 2024·Granted Dec 30, 2025·0 cites·10 claims
- 0459US2025300112A1Integrated device comprising extended metallization region for pillar interconnectsQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0558US2025300080A1INTEGRATED CIRCUITS (ICs) HAVING SEPARATE SIGNAL AND POWER DISTRIBUTION NETWORK (PDN) INTERCONNECT STRUCTURES FOR REDUCED POWER SIGNAL ROUTING CONGESTION AND PATH LENGTHS, AND RELATED THREE-DIMENSIONAL (3D) ICs (3DICs) AND FABRICATION METHODSQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0657US2025062285A1Stacked integrated circuit devicesQUALCOMM INC·Filed 2023·Application pending·0 cites
- 0757US2025096094A1Io interconnect cage structure for package form reductionQUALCOMM INC·Filed 2023·Application pending·0 cites
- 0857US2025069965A1Package comprising a substrate with an embedded frameQUALCOMM INC·Filed 2023·Application pending·0 cites
- 0956US2025096207A1Package comprising a bridge located between metallization portionsQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1055US12243855B2Package comprising channel interconnects located between solder interconnectsQUALCOMM INC·Filed 2021·Granted Mar 4, 2025·0 cites·20 claims
- 1154US2024363605A1Stacked integrated circuit device including integrated capacitor deviceQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1252US2024038831A1Package with a substrate comprising embedded stacked trench capacitor devicesQUALCOMM INC·Filed 2022·Application pending·0 cites
- 1350US2014225246A1Dual substrate, power distribution and thermal solution for direct stacked integrated devicesQUALCOMM INC·Filed 2013·Application pending·0 cites
- 1448US11817406B2Semiconductor die employing repurposed seed layer for forming additional signal paths to back end-of-line (BEOL) structure, and related integrated circuit (IC) packages and fabrication methodsQUALCOMM INC·Filed 2021·Granted Nov 14, 2023·0 cites·29 claims
- 1544US9165791B2Wireless interconnects in an interposerQUALCOMM INC·Filed 2013·Granted Oct 20, 2015·0 cites·17 claims
- 1644US2013286595A1Thermal management floorplan for a multi-tier stacked ic packageQUALCOMM INC·Filed 2012·Application pending·0 cites
- 1740US2014252561A1Via-enabled package-on-packageQUALCOMM INC·Filed 2013·Application pending·0 cites
- 1836US2011193212A1Systems and Methods Providing Arrangements of ViasQUALCOMM INC·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →