Inventor · disambiguated record
Vincent J. Mcgahay
Also filed as: MCGAHAY VINCENT · MCGAHAY VINCENT J · MCGAHAY VINCENT JAMES
77 granted patents·12 pending applications·1,170 citations·filing 1994–2021
99Inventor score
Files withIBM70GLOBALFOUNDRIES INC8GLOBALFOUNDRIES US INC3INFINEON TECHNOLOGIES AG2ADVANCED MICRO DEVICES INC AMD1
Top patents by PatentIndex Score
89 records- 0194US10062748B1Segmented guard-ring and chip edge sealsGLOBALFOUNDRIES INC·Filed 2017·Granted Aug 28, 2018·10 cites·18 claims
- 0294US8013394B2Integrated circuit having resistor between BEOL interconnect and FEOL structure and related methodIBM·Filed 2007·Granted Sep 6, 2011·30 cites·12 claims
- 0393US10032683B2Time temperature monitoring systemIBM·Filed 2015·Granted Jul 24, 2018·10 cites·5 claims
- 0493US7253105B2Reliable BEOL integration process with direct CMP of porous SiCOH dielectricIBM·Filed 2005·Granted Aug 7, 2007·26 cites·20 claims
- 0592US9412654B1Graphene sacrificial deposition layer on beol copper liner-seed for mitigating queue-time issues between liner and plating stepIBM·Filed 2015·Granted Aug 9, 2016·9 cites·20 claims
- 0691US8232648B2Semiconductor article having a through silicon via and guard ringMCGAHAY VINCENT J·Filed 2010·Granted Jul 31, 2012·20 cites·17 claims
- 0791US8129286B2Reducing effective dielectric constant in semiconductor devicesEDELSTEIN DANIEL C·Filed 2008·Granted Mar 6, 2012·11 cites·32 claims
- 0891US7892940B2Device and methodology for reducing effective dielectric constant in semiconductor devicesIBM·Filed 2007·Granted Feb 22, 2011·11 cites·25 claims
- 0991US7405147B2Device and methodology for reducing effective dielectric constant in semiconductor devicesIBM·Filed 2004·Granted Jul 29, 2008·35 cites·31 claims
- 1090US10504807B2Time temperature monitoring systemIBM·Filed 2018·Granted Dec 10, 2019·5 cites·19 claims
- 1190US6261945B1Crackstop and oxygen barrier for low-K dielectric integrated circuitsIBM·Filed 2000·Granted Jul 17, 2001·73 cites·12 claims
- 1289US11705396B2Method to form air gap structure with dual dielectric layerGLOBALFOUNDRIES US INC·Filed 2021·Granted Jul 18, 2023·2 cites·20 claims
- 1389US10546822B2Seal ring structure of integrated circuit and method of forming sameGLOBALFOUNDRIES INC·Filed 2017·Granted Jan 28, 2020·6 cites·19 claims
- 1489US8343868B2Device and methodology for reducing effective dielectric constant in semiconductor devicesIBM·Filed 2011·Granted Jan 1, 2013·6 cites·20 claims
- 1589US7098676B2Multi-functional structure for enhanced chip manufacturibility and reliability for low k dielectrics semiconductors and a crackstop integrity screen and monitorIBM·Filed 2003·Granted Aug 29, 2006·49 cites·12 claims
- 1688US7067902B2Building metal pillars in a chip for structure supportIBM·Filed 2003·Granted Jun 27, 2006·42 cites·10 claims
- 1788US6737747B2Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereofIBM·Filed 2002·Granted May 18, 2004·43 cites·13 claims
- 1887US11127678B2Dual dielectric layer for closing seam in air gap structureGLOBALFOUNDRIES US INC·Filed 2019·Granted Sep 21, 2021·6 cites·15 claims
- 1987US7592685B2Device and methodology for reducing effective dielectric constant in semiconductor devicesIBM·Filed 2007·Granted Sep 22, 2009·7 cites·20 claims
- 2087US5530293ACarbon-free hydrogen silsesquioxane with dielectric constant less than 3.2 annealed in hydrogen for integrated circuitsIBM·Filed 1994·Granted Jun 25, 1996·75 cites·14 claims
- 2186US7439151B2Method and structure for integrating MIM capacitors within dual damascene processing techniquesIBM·Filed 2006·Granted Oct 21, 2008·12 cites·19 claims
- 2286US6821890B2Method for improving adhesion to copperIBM·Filed 2001·Granted Nov 23, 2004·37 cites·16 claims
- 2386US6486557B1Hybrid dielectric structure for improving the stiffness of back end of the line structuresIBM·Filed 2000·Granted Nov 26, 2002·48 cites·11 claims
- 2485US7109093B2Crackstop with release layer for crack control in semiconductorsIBM·Filed 2004·Granted Sep 19, 2006·32 cites·19 claims
- 2585US6331481B1Damascene etchback for low ε dielectricIBM·Filed 1999·Granted Dec 18, 2001·75 cites·47 claims
- 2683US6939797B2Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereofIBM·Filed 2003·Granted Sep 6, 2005·26 cites·20 claims
- 2783US6133136ARobust interconnect structureIBM·Filed 1999·Granted Oct 17, 2000·77 cites·37 claims
- 2882US8237246B2Deep trench crackstops under contactsANGYAL MATTHEW S·Filed 2010·Granted Aug 7, 2012·7 cites·16 claims
- 2982US6972209B2Stacked via-stud with improved reliability in copper metallurgyIBM·Filed 2002·Granted Dec 6, 2005·32 cites·8 claims
- 3082US6887783B2Bilayer HDP CVD/PE CVD cap in advance BEOL interconnect structures and method thereofINFINEON TECHNOLOGIES AG·Filed 2003·Granted May 3, 2005·26 cites·18 claims
- 3180US10109600B1Crackstop structuresGLOBALFOUNDRIES INC·Filed 2017·Granted Oct 23, 2018·2 cites·20 claims
- 3280US7531444B2Method to create air gaps using non-plasma processes to damage ILD materialsIBM·Filed 2005·Granted May 12, 2009·10 cites·30 claims
- 3380US7456098B2Building metal pillars in a chip for structure supportIBM·Filed 2006·Granted Nov 25, 2008·8 cites·8 claims
- 3479US7388224B2Structure for determining thermal cycle reliabilityIBM·Filed 2006·Granted Jun 17, 2008·4 cites·14 claims
- 3578US9373561B1Integrated circuit barrierless microfluidic channelIBM·Filed 2014·Granted Jun 21, 2016·3 cites·10 claims
- 3678US7253100B2Reducing damage to ulk dielectric during cross-linked polymer removalIBM·Filed 2005·Granted Aug 7, 2007·5 cites·20 claims
- 3778US6278147B1On-chip decoupling capacitor with bottom hardmaskIBM·Filed 2000·Granted Aug 21, 2001·19 cites·6 claims
- 3877US9362230B1Methods to form conductive thin film structuresGLOBALFOUNDRIES INC·Filed 2015·Granted Jun 7, 2016·2 cites·20 claims
- 3975US10060974B2Electrical circuit odometer sensor arrayIBM·Filed 2014·Granted Aug 28, 2018·5 cites·20 claims
- 4075US6478212B1Bond pad structure and method for reduced downward force wirebondingIBM·Filed 2001·Granted Nov 12, 2002·22 cites·21 claims
- 4174US7485582B2Hardmask for improved reliability of silicon based dielectricsIBM·Filed 2008·Granted Feb 3, 2009·5 cites·13 claims
- 4274US7335980B2Hardmask for reliability of silicon based dielectricsIBM·Filed 2004·Granted Feb 26, 2008·12 cites·13 claims
- 4373US7979151B2Run-time dispatch system for enhanced product characterization capabilityIBM·Filed 2007·Granted Jul 12, 2011·2 cites·17 claims
- 4472US7948083B2Reliable BEOL integration process with direct CMP of porous SiCOH dielectricIBM·Filed 2007·Granted May 24, 2011·4 cites·13 claims
- 4572US6831363B2Structure and method for reducing thermo-mechanical stress in stacked viasIBM·Filed 2002·Granted Dec 14, 2004·18 cites·15 claims
- 4672US6674168B1Single and multilevel reworkIBM·Filed 2003·Granted Jan 6, 2004·17 cites·20 claims
- 4771US6982227B2Single and multilevel reworkIBM·Filed 2003·Granted Jan 3, 2006·16 cites·6 claims
- 4871US6914320B2Bilayer HDP CVD/PE CVD cap in advanced BEOL interconnect structures and method thereofINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jul 5, 2005·13 cites·17 claims
- 4970US7303994B2Process for interfacial adhesion in laminate structures through patterned roughing of a surfaceIBM·Filed 2004·Granted Dec 4, 2007·10 cites·5 claims
- 5069US7972965B2Process for interfacial adhesion in laminate structures through patterned roughing of a surfaceIBM·Filed 2007·Granted Jul 5, 2011·2 cites·16 claims
Showing the top 50 of 89 patent records by PatentIndex Score.
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