Inventor · disambiguated record
Tadao Nakaoka
Also filed as: NAKAOKA TADAO
4 granted patents·94 citations·filing 1997–2005
79Inventor score
Top patents by PatentIndex Score
4 records- 0196US7175920B2Copper foil for high-density ultra-fine printed wiring boardCIRCUIT FOIL JAPAN·Filed 2005·Granted Feb 13, 2007·25 cites·17 claims
- 0293US7026059B2Copper foil for high-density ultrafine printed wiring boadCIRCUIT FOIL JAPAN·Filed 2001·Granted Apr 11, 2006·36 cites·28 claims
- 0362US5792333AMethod of surface-roughening treatment of copper foilCIRCUIT FOIL JAPAN·Filed 1997·Granted Aug 11, 1998·25 cites·21 claims
- 0457US7172818B2Copper foil for chip-on-film use, plasma display panel, or high-frequency printed circuit boardFURUKAWA CIRCUIT FOIL·Filed 2003·Granted Feb 6, 2007·8 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →