Inventor · disambiguated record
Byung-Moon Bae
Also filed as: Bae byung moon
8 granted patents·7 citations·filing 2019–2021
76Inventor score
Files withSAMSUNG ELECTRONICS CO LTD8
Top patents by PatentIndex Score
8 records- 0185US10651105B2Semiconductor chip that includes a cover protection layer covering a portion of a passivation layerSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 12, 2020·5 cites·20 claims
- 0269US11145601B2Semiconductor chip including alignment patternSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 12, 2021·1 cites·20 claims
- 0369US10854517B2Methods of manufacturing semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 1, 2020·1 cites·20 claims
- 0466US11710706B2Method of dicing a semiconductor substrate having a scribe lane defined thereinSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims
- 0561US11967529B2Methods of manufacturing semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 23, 2024·0 cites·20 claims
- 0656US11107773B2Semiconductor device, semiconductor chip and method of dicing a semiconductor substrateSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 31, 2021·0 cites·19 claims
- 0750US11244911B2Chip including a scribe laneSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 8, 2022·0 cites·17 claims
- 0848US10886234B2Semiconductor device and semiconductor package comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 5, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →