Inventor · disambiguated record
Toru Ishizuka
Also filed as: ISHIZUKA TORU
16 granted patents·2 pending applications·42 citations·filing 2003–2022
88Inventor score
Top patents by PatentIndex Score
18 records- 0181US11056381B2Method for producing bonded SOI waferSHINETSU HANDOTAI KK·Filed 2016·Granted Jul 6, 2021·3 cites·6 claims
- 0271US10600677B2Method for manufacturing bonded SOI waferSHINETSU HANDOTAI KK·Filed 2017·Granted Mar 24, 2020·2 cites·4 claims
- 0370US9735045B2Method of fabricating SOI wafer by ion implantationSHINETSU HANDOTAI KK·Filed 2014·Granted Aug 15, 2017·2 cites·7 claims
- 0467US7499573B2Plant growing analyzing system and methodHITACHI LTD·Filed 2004·Granted Mar 3, 2009·27 cites·17 claims
- 0564US9337080B2Method for manufacturing SOI waferSHINETSU HANDOTAI KK·Filed 2013·Granted May 10, 2016·1 cites·15 claims
- 0663US9076840B2Method for manufacturing a bonded SOI waferSHINETSU HANDOTAI KK·Filed 2012·Granted Jul 7, 2015·1 cites·4 claims
- 0756US7534105B2Occludator, face bow, occlusion-confirming system and temporomandibular joint-reproducing systemUNIV NIHON·Filed 2003·Granted May 19, 2009·6 cites·26 claims
- 0853US2025031421A1Substrate for electronic device and method for producing the sameSHIN ETSU HANDOTAI CO LTD·Filed 2022·Application pending·0 cites
- 0947US9378999B2Method for manufacturing SOI waferSHINETSU HANDOTAI KK·Filed 2013·Granted Jun 28, 2016·0 cites·18 claims
- 1045US9673085B2Method for manufacturing SOI waferSHINETSU HANDOTAI KK·Filed 2013·Granted Jun 6, 2017·0 cites·11 claims
- 1144US9093497B2Method for manufacturing bonded SOI waferSHINETSU HANDOTAI KK·Filed 2012·Granted Jul 28, 2015·0 cites·16 claims
- 1244US9029240B2Method for manufacturing SOI waferSHINETSU HANDOTAI KK·Filed 2013·Granted May 12, 2015·0 cites·19 claims
- 1342US11244852B2Method for manufacturing bonded SOI waferSHINETSU HANDOTAI KK·Filed 2019·Granted Feb 8, 2022·0 cites·8 claims
- 1441US7521334B2Method for producing direct bonded wafer and direct bonded waferSHINETSU HANDOTAI KK·Filed 2005·Granted Apr 21, 2009·0 cites·22 claims
- 1538US10424484B2Method for manufacturing a bonded SOI waferSHINETSU HANDOTAI KK·Filed 2016·Granted Sep 24, 2019·0 cites·4 claims
- 1636US2018277422A1Bonded wafer production method and bonded waferSHINETSU HANDOTAI KK·Filed 2018·Application pending·0 cites
- 1731US9842763B2Method for manufacturing bonded waferSHINETSU HANDOTAI KK·Filed 2015·Granted Dec 12, 2017·0 cites·16 claims
- 1831US9496130B2Reclaiming processing method for delaminated waferISHIZUKA TORU·Filed 2012·Granted Nov 15, 2016·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →