Inventor · disambiguated record
Gabriel Antonio Paulius Velarde
Also filed as: VELARDE GABRIEL ANTONIO PAULIUS
9 granted patents·27 citations·filing 2021–2023
80Inventor score
Files withKEPLER COMPUTING INC9
Top patents by PatentIndex Score
9 records- 0197US11659714B1Ferroelectric device film stacks with texturing layer, and method of forming suchKEPLER COMPUTING INC·Filed 2021·Granted May 23, 2023·27 cites·19 claims
- 0277US12094923B2Rapid thermal annealing (RTA) methodologies for integration of perovskite-material based memory devicesKEPLER COMPUTING INC·Filed 2022·Granted Sep 17, 2024·0 cites·13 claims
- 0377US11908704B2Method of fabricating a perovskite-material based planar capacitor using rapid thermal annealing (RTA) methodologiesKEPLER COMPUTING INC·Filed 2022·Granted Feb 20, 2024·0 cites·20 claims
- 0476US11894417B2Method of fabricating a perovskite-material based trench capacitor using rapid thermal annealing (RTA) methodologiesKEPLER COMPUTING INC·Filed 2022·Granted Feb 6, 2024·0 cites·20 claims
- 0576US11769790B2Rapid thermal annealing (RTA) methodologies for integration of perovskite-material based trench capacitorsKEPLER COMPUTING INC·Filed 2022·Granted Sep 26, 2023·0 cites·21 claims
- 0670US11744081B1Ferroelectric device film stacks with texturing layer which is part of a bottom electrode, and method of forming suchKEPLER COMPUTING INC·Filed 2021·Granted Aug 29, 2023·0 cites·19 claims
- 0770US11716858B1Ferroelectric device film stacks with texturing layer which is part of a bottom electrode and a barrier, and method of forming suchKEPLER COMPUTING INC·Filed 2021·Granted Aug 1, 2023·0 cites·19 claims
- 0868US12262543B1High density ferroelectric random access memory (FeRAM) devices and methods of fabricationKEPLER COMPUTING INC·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 0962US11832451B1High density ferroelectric random access memory (FeRAM) devices and methods of fabricationKEPLER COMPUTING INC·Filed 2021·Granted Nov 28, 2023·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →