Inventor · disambiguated record
Thomas G. Mallon
Also filed as: MALLON THOMAS G
11 granted patents·777 citations·filing 1992–1997
94Inventor score
Top patents by PatentIndex Score
11 records- 0195US5624304ATechniques for assembling polishing pads for chemi-mechanical polishing of silicon wafersLSI LOGIC INC·Filed 1994·Granted Apr 29, 1997·115 cites·18 claims
- 0295US5516400ATechniques for assembling polishing pads for chemical-mechanical polishing of silicon wafersLSI LOGIC CORP·Filed 1994·Granted May 14, 1996·83 cites·7 claims
- 0394US5310455ATechniques for assembling polishing pads for chemi-mechanical polishing of silicon wafersLSI LOGIC CORP·Filed 1992·Granted May 10, 1994·91 cites·9 claims
- 0493US5722877ATechnique for improving within-wafer non-uniformity of material removal for performing CMPLAM RES CORP·Filed 1996·Granted Mar 3, 1998·132 cites·28 claims
- 0586US5278103AMethod for the controlled formation of voids in doped glass dielectric filmsLSI LOGIC CORP·Filed 1993·Granted Jan 11, 1994·82 cites·18 claims
- 0685US5667433AKeyed end effector for CMP pad conditionerLSI LOGIC CORP·Filed 1995·Granted Sep 16, 1997·72 cites·11 claims
- 0783US5628869APlasma enhanced chemical vapor reactor with shaped electrodesLSI LOGIC CORP·Filed 1994·Granted May 13, 1997·73 cites·5 claims
- 0878US6109775AMethod for adjusting the density of lines and contact openings across a substrate region for improving the chemical-mechanical polishing of a thin-film later disposed thereonLSI LOGIC CORP·Filed 1997·Granted Aug 29, 2000·60 cites·18 claims
- 0971US5876838ASemiconductor integrated circuit processing wafer having a PECVD material layer of improved thickness uniformityLSI LOGIC CORP·Filed 1996·Granted Mar 2, 1999·34 cites·14 claims
- 1053US5719084AMethod for the controlled formation of voids in doped glass dielectric filmsLSI LOGIC CORP·Filed 1995·Granted Feb 17, 1998·16 cites·42 claims
- 1149US5362353AFaraday cage for barrel-style plasma etchersLSI LOGIC CORP·Filed 1993·Granted Nov 8, 1994·19 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →