Inventor · disambiguated record
Byoung-Ok Lee
Also filed as: LEE BYOUNG OK THI · LEE BYOUNG-OK
12 granted patents·5 pending applications·267 citations·filing 1999–2025
91Inventor score
Files withFAIRCHILD KR SEMICONDUCTOR LTD3JEON OSEOB2MTEK VISION CO LTD2SILICONARTS TECH US INC2SON JOON-SEO2
Top patents by PatentIndex Score
17 records- 0196US7061080B2Power module package having improved heat dissipating capabilityFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2002·Granted Jun 13, 2006·127 cites·15 claims
- 0294US8183088B2Semiconductor die package and method for making the sameJEON OSEOB·Filed 2010·Granted May 22, 2012·22 cites·14 claims
- 0392US7208819B2Power module package having improved heat dissipating capabilityFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2004·Granted Apr 24, 2007·69 cites·11 claims
- 0487US8664752B2Semiconductor die package and method for making the sameJEON OSEOB·Filed 2012·Granted Mar 4, 2014·9 cites·10 claims
- 0586US8552541B2Power device packages having thermal electric modules using peltier effect and methods of fabricating the sameIM SEUNGWON·Filed 2011·Granted Oct 8, 2013·15 cites·20 claims
- 0677US2025322585A1Multichip ray tracing device and methodSILICONARTS TECH US INC·Filed 2025·Application pending·0 cites
- 0774US8067826B2Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the packageSON JOON-SEO·Filed 2008·Granted Nov 29, 2011·5 cites·10 claims
- 0869US12374019B2Multichip ray tracing device and methodSILICONARTS TECH US INC·Filed 2022·Granted Jul 29, 2025·0 cites·7 claims
- 0964US9070071B2Card-type information recording medium having embedded antenna for near field communication and manufacturing method thereofMTEK VISION CO LTD·Filed 2014·Granted Jun 30, 2015·1 cites·6 claims
- 1063US9141905B2Card-type information recording medium having embedded antenna for near field communication and manufacturing method thereofBAEK DONG-HYUN·Filed 2012·Granted Sep 22, 2015·2 cites·10 claims
- 1154US9159656B2Semiconductor die package and method for making the sameFAIRCHILD SEMICONDUCTOR·Filed 2013·Granted Oct 13, 2015·0 cites·9 claims
- 1250US6445418B1Video coding and decoding methodLG ELECTRONICS INC·Filed 1999·Granted Sep 3, 2002·17 cites·21 claims
- 1348US8945992B2Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the packageSON JOON-SEO·Filed 2011·Granted Feb 3, 2015·0 cites·9 claims
- 1445US2009201256A1Portable terminal having inputting means using image sensorMTEK VISION CO LTD·Filed 2005·Application pending·0 cites
- 1545US2009243078A1Power Device Packages Having Thermal Electric Modules Using Peltier Effect and Methods of Fabricating the SameLIM SEUNG-WON·Filed 2009·Application pending·0 cites
- 1638US2013307145A1Semiconductor package and method of fabricating the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2013·Application pending·0 cites
- 1737US2016239994A1Method of ray tracing, apparatus performing the same and storage media storing the sameSILICONARTS INC·Filed 2014·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →