Inventor · disambiguated record
Shenghua Huang
Also filed as: HUANG SHENGHUA
5 granted patents·3 pending applications·7 citations·filing 2003–2022
66Inventor score
Top patents by PatentIndex Score
8 records- 0184US12033958B2Semiconductor device including a suspended reinforcing layer and method of manufacturing sameWESTERN DIGITAL TECH INC·Filed 2021·Granted Jul 9, 2024·1 cites·18 claims
- 0260US11978713B2Flip chip bump with multi-PI openingWESTERN DIGITAL TECH INC·Filed 2022·Granted May 7, 2024·0 cites·17 claims
- 0356US11961778B2Semiconductor device package having multi-layer molding compound and methodWESTERN DIGITAL TECH INC·Filed 2021·Granted Apr 16, 2024·0 cites·20 claims
- 0455US7136647B2Method for decide CDMA frequency hard handoffsZTE CORP·Filed 2003·Granted Nov 14, 2006·6 cites·12 claims
- 0551US2023395446A1Mechanical support for a tall offset die stackWESTERN DIGITAL TECH INC·Filed 2022·Application pending·0 cites
- 0649US2023402361A1Semiconductor device including reinforcing blocksWESTERN DIGITAL TECH INC·Filed 2022·Application pending·0 cites
- 0748US12027497B2Semiconductor device with unbalanced die stackupWESTERN DIGITAL TECH INC·Filed 2022·Granted Jul 2, 2024·0 cites·20 claims
- 0839US2020006212A1Semiconductor product substrate including stress relief layerWESTERN DIGITAL TECH INC·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →