Inventor · disambiguated record
Yuh-Da Fan
Also filed as: FAN YUH-DA
9 granted patents·4 pending applications·370 citations·filing 1996–2013
90Inventor score
Top patents by PatentIndex Score
13 records- 0193US6936544B2Method of removing metal etching residues following a metal etchback process to improve a CMP processTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Aug 30, 2005·105 cites·22 claims
- 0286US6124212AHigh density plasma (HDP) etch method for suppressing micro-loading effects when etching polysilicon layersTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Sep 26, 2000·101 cites·24 claims
- 0381US6022809AComposite shadow ring for an etch chamber and method of usingTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Feb 8, 2000·65 cites·20 claims
- 0476US5854136AThree-step nitride etching process for better critical dimension and better vertical sidewall profileTAIWAN SEMICONDUCTOR MFG·Filed 1996·Granted Dec 29, 1998·48 cites·20 claims
- 0570US6303509B1Method to calibrate the wafer transfer for oxide etcher (with clamp)TAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Oct 16, 2001·35 cites·20 claims
- 0662US9564321B2Cyclic epitaxial deposition and etch processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 7, 2017·1 cites·20 claims
- 0754US2010099252A1Methods to completely eliminate or significantly reduce defects in copper metallization in IC manufacturingTAIWAN SEMICONDUCTOR MFG·Filed 2009·Application pending·0 cites
- 0853US6531326B2Method to calibrate the wafer transfer for oxide etcher (with clamp)TAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Mar 11, 2003·4 cites·15 claims
- 0950US2008176397A1Methods to completely eliminate or significantly reduce defects in copper metallization in IC manufacturingTAIWAN SEMICONDUCTOR MFG·Filed 2007·Application pending·0 cites
- 1043US7262067B2Method for conductive film quality evaluationTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Aug 28, 2007·1 cites·23 claims
- 1142US6221745B1High selectivity mask oxide etching to suppress silicon pitsTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Apr 24, 2001·10 cites·16 claims
- 1242US2006094237A1Methods to completely eliminate or significantly reduce defects in copper metallization in IC manufacturingTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
- 1334US2005173799A1Interconnect structure and method for its fabricatingTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yuh-Da Fan files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →