Inventor · disambiguated record
Clement Fortin
Also filed as: FORTIN CLEMENT · FORTIN CLEMENT J
10 granted patents·2 pending applications·49 citations·filing 2002–2021
85Inventor score
Files withIBM7BERGERON CHRISTIAN1BLAIS PASCAL1MCLEAN GERARD F1SOC DE COMMERCIALISATION DES PRODUITS DE LA RECHERCHE APPLIQUEE SOCPRA SCIENCES ET GENIE S E C1
Top patents by PatentIndex Score
12 records- 0183US6739497B2SMT passive device noflow underfill methodology and structureIBM·Filed 2002·Granted May 25, 2004·31 cites·17 claims
- 0280US10756041B1Finned contactIBM·Filed 2019·Granted Aug 25, 2020·3 cites·20 claims
- 0377US10586782B2Lead-free solder joining of electronic structuresIBM·Filed 2017·Granted Mar 10, 2020·2 cites·25 claims
- 0474US7408264B2SMT passive device noflow underfill methodology and structureIBM·Filed 2006·Granted Aug 5, 2008·5 cites·4 claims
- 0562US11043468B2Lead-free solder joining of electronic structuresIBM·Filed 2020·Granted Jun 22, 2021·0 cites·10 claims
- 0661US7109592B2SMT passive device noflow underfill methodology and structureIBM·Filed 2004·Granted Sep 19, 2006·8 cites·1 claims
- 0751US8286464B2Sensing device and methods related theretoMCLEAN GERARD F·Filed 2008·Granted Oct 16, 2012·0 cites·49 claims
- 0848US10950573B2Lead-free column interconnectIBM·Filed 2019·Granted Mar 16, 2021·0 cites·9 claims
- 0947US2024113060A1Heterogeneous solder bump structureSOC DE COMMERCIALISATION DES PRODUITS DE LA RECHERCHE APPLIQUEE SOCPRA SCIENCES ET GENIE S E C·Filed 2021·Application pending·0 cites
- 1036US8514386B2Technique for verifying the microstructure of lead-free interconnects in semiconductor assembliesBERGERON CHRISTIAN·Filed 2011·Granted Aug 20, 2013·0 cites·19 claims
- 1135US2004092932A1Adjustable surgical templatesFiled 2003·Application pending·0 cites
- 1234US8673761B2Reflow method for lead-free solderBLAIS PASCAL·Filed 2011·Granted Mar 18, 2014·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →