Inventor · disambiguated record
Yong Chern Poh
Also filed as: POH YONG CHERN
4 granted patents·2 pending applications·8 citations·filing 2008–2020
67Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0176US10741466B2Formation of conductive connection tracks in package mold body using electroless platingINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 11, 2020·3 cites·7 claims
- 0275US11296000B2Formation of conductive connection tracks in package mold body using electroless platingINFINEON TECHNOLOGIES AG·Filed 2020·Granted Apr 5, 2022·1 cites·7 claims
- 0365US10325837B2Molded semiconductor package with C-wing and gull-wing leadsINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 18, 2019·2 cites·20 claims
- 0457US7674657B2Method of manufacture of encapsulated packageINFINEON TECHNOLOGIES AG·Filed 2008·Granted Mar 9, 2010·2 cites·15 claims
- 0541US2010193920A1Semiconductor device, leadframe and method of encapsulatingINFINEON TECHNOLOGIES AG·Filed 2009·Application pending·0 cites
- 0637US2013154123A1Semiconductor Device and Fabrication MethodPOH YONG CHERN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →