Inventor · disambiguated record
Guarionex Morales
Also filed as: MORALES GUARIONEX
23 granted patents·1 pending application·492 citations·filing 1997–2001
96Inventor score
Top patents by PatentIndex Score
24 records- 0191US6033584AProcess for reducing copper oxide during integrated circuit fabricationADVANCED MICRO DEVICES INC·Filed 1997·Granted Mar 7, 2000·118 cites·18 claims
- 0280US6096648ACopper/low dielectric interconnect formation with reduced electromigrationAMD·Filed 1999·Granted Aug 1, 2000·59 cites·18 claims
- 0376US6436850B1Method of degassing low k dielectric for metal depositionFiled 2000·Granted Aug 20, 2002·25 cites·14 claims
- 0476US6127193ATest structure used to measure metal bottom coverage in trenches and vias/contacts and method for creating the test structureADVANCED MICRO DEVICES INC·Filed 1998·Granted Oct 3, 2000·41 cites·20 claims
- 0575US6281121B1Damascene metal interconnects using highly directional deposition of barrier and/or seed layers including (III) filling metalADVANCED MICRO DEVICES INC·Filed 1998·Granted Aug 28, 2001·47 cites·38 claims
- 0664US6444593B1Surface treatment of low-K SiOF to prevent metal interactionADVANCED MICRO DEVICES INC·Filed 1999·Granted Sep 3, 2002·28 cites·20 claims
- 0761US6083817ACobalt silicidation using tungsten nitride capping layerADVANCED MICRO DEVICES INC·Filed 1999·Granted Jul 4, 2000·19 cites·18 claims
- 0860US5994778ASurface treatment of low-k SiOF to prevent metal interactionADVANCED MICRO DEVICES INC·Filed 1998·Granted Nov 30, 1999·21 cites·11 claims
- 0958US6235632B1Tungsten plug formationADVANCED MICRO DEVICES INC·Filed 1998·Granted May 22, 2001·23 cites·2 claims
- 1054US6046106AHigh density plasma oxide gap filled patterned metal layers with improved electromigration resistanceADVANCED MICRO DEVICES INC·Filed 1997·Granted Apr 4, 2000·18 cites·25 claims
- 1153US6420104B1Method of reducing contact size by spacer fillingADVANCED MICRO DEVICES INC·Filed 2000·Granted Jul 16, 2002·5 cites·19 claims
- 1253US6380556B1Test structure used to measure metal bottom coverage in trenches and vias/contacts and method for creating the test structureADVANCED MICRO DEVICES INC·Filed 2000·Granted Apr 30, 2002·3 cites·8 claims
- 1349US6110829AUltra-low temperature Al fill for sub-0.25 μm generation of ICs using an Al-Ge-Cu alloyADVANCED MICRO DEVICES INC·Filed 1997·Granted Aug 29, 2000·15 cites·3 claims
- 1448US6335533B1Electron microscopy sample having silicon nitride passivation layerADVANCED MICRO DEVICES INC·Filed 1998·Granted Jan 1, 2002·12 cites·17 claims
- 1546US6030891AVacuum baked HSQ gap fill layer for high integrity borderless viasADVANCED MICRO DEVICES INC·Filed 1997·Granted Feb 29, 2000·12 cites·27 claims
- 1645US6335273B2Surface treatment of low-K SiOF to prevent metal interactionADVANCED MICRO DEVICES INC·Filed 1999·Granted Jan 1, 2002·10 cites·8 claims
- 1744US6281584B1Integrated circuit with improved adhesion between interfaces of conductive and dielectric surfacesADVANCED MICRO DEVICES INC·Filed 1999·Granted Aug 28, 2001·10 cites·20 claims
- 1842US6211074B1Methods and arrangements for reducing stress and preventing cracking in a silicide layerADVANCED MICRO DEVICES INC·Filed 1998·Granted Apr 3, 2001·9 cites·9 claims
- 1940US6265294B1Integrated circuit having double bottom anti-reflective coating layerADVANCED MICRO DEVICES INC·Filed 1999·Granted Jul 24, 2001·8 cites·20 claims
- 2036US6500757B1Method and apparatus for controlling grain growth roughening in conductive stacksADVANCED MICRO DEVICES INC·Filed 2000·Granted Dec 31, 2002·0 cites·24 claims
- 2136US2001053600A1Methods for characterizing and reducing adverse effects of texture of semiconductor filmsFiled 2001·Application pending·0 cites
- 2235US6100192AMethod of forming high integrity tungsten silicide thin filmsADVANCED MICRO DEVICES INC·Filed 1997·Granted Aug 8, 2000·3 cites·21 claims
- 2332US6265273B1Method of forming rectangular shaped spacersADVANCED MICRO DEVICES INC·Filed 1999·Granted Jul 24, 2001·2 cites·20 claims
- 2432US6177345B1Method of silicide film formation onto a semiconductor substrateADVANCED MICRO DEVICES INC·Filed 1998·Granted Jan 23, 2001·4 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →