Inventor · disambiguated record
Nam Keun Oh
Also filed as: OH NAM KEUN
9 granted patents·4 pending applications·8 citations·filing 2010–2023
78Inventor score
Top patents by PatentIndex Score
13 records- 0178US9152260B2Touch panel and fabricating method thereofSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 6, 2015·6 cites·9 claims
- 0269US9519366B2Touch sensorSAMSUNG ELECTRO MECH·Filed 2014·Granted Dec 13, 2016·2 cites·16 claims
- 0357US12375784B2Camera module with piezoelectric driving memberSAMSUNG ELECTRO MECH·Filed 2023·Granted Jul 29, 2025·0 cites·12 claims
- 0455US12276811B2Sensor shifting actuator and camera module including sensor shifting actuatorSAMSUNG ELECTRO MECH·Filed 2023·Granted Apr 15, 2025·0 cites·23 claims
- 0553US2023209200A1Camera moduleSAMSUNG ELECTRO MECH·Filed 2022·Application pending·0 cites
- 0652US9383781B2Touch sensorSAMSUNG ELECTRO MECH·Filed 2014·Granted Jul 5, 2016·0 cites·14 claims
- 0752US8945993B2Method of manufacturing a ball grid array substrate or a semiconductor chip packageSAMSUNG ELECTRO MECH·Filed 2013·Granted Feb 3, 2015·0 cites·6 claims
- 0847US8546943B2Ball grid array substrate with insulating layer and semiconductor chip packagePARK JUNG HYUN·Filed 2010·Granted Oct 1, 2013·0 cites·5 claims
- 0945US2014069692A1Touch panelSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 1045US2012244662A1Board on chip package substrate and manufacturing method thereofKIM JI-EUN·Filed 2012·Application pending·0 cites
- 1144US8986555B2Method of manufacturing printed circuit board having bumpKIM JI-EUN·Filed 2010·Granted Mar 24, 2015·0 cites·4 claims
- 1242US2011110058A1Board on chip package substrate and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 1334US8889994B2Single-layered printed circuit board and manufacturing method thereofKIM YOUNG-JI·Filed 2011·Granted Nov 18, 2014·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →